MEMS & Sensors packaging: Wafer-Level …

1 mems & Sensors packaging : Wafer-Level -PackagingTechnology and market trendsAmandine Pizzagalli, technology & Market Analyst Equipment & MaterialsFields of expertise:YoleD veloppement s30 analysts operate in the following areasMEMS & SensorsDisplaysCompound Semi LED & OLEDsImagingPhotonicsMedTechManufacturin gAdvanced PackagingBatteries / EnergyManagementPower ElectronicsA group of companiesMarket, technology and strategy operationsDue and business costs analysisTeardown and reverse engineeringCost simulation analysisPatent of the presentation Market trends & mems Sensors Focus on packaging technologies for mems devices ConclusionThe 5 senses and many more: mems , sensorsThe 5 senses and many more: mems , Sensors & actuatorsMEMS & Sensors RoadmapFrom More than Moore towards Beyond LawOverview of the mems Sensors & actuatorsACTUATORSSENSORSP ressureSound(microphone)EnvironmentOptic al sensorsDrug deliveryMicrofluidicsInk jet headsAuto-FocusMicro mirrorsRFOptical MEMSM icro structuresParticlesHumidityMovementGasMa gnetometersIMUs (6 to 9 DOF)

2 AccelerometersGyroscopesTemperatureOptic al benchesMicro tipsProbesWatches componentsPIR & thermopilesMicro bolometersSwitchFilterBosch BME680 FLIR Lepton OneInfineonmicrophoneSTM pressure sensorInvensenseMPU9250 Debiotechmicro pumpTexas Instruments DLPA vagoFBAR FilterSpiromaxPatekPhilippeAudio Pixels mems basedspeakerResonatorBiochipspoLightAFSi TimeoscillatorAmbient light sensorFingerprintVisionOptical combos open packageenvironmental combos closed package6 to 11 DOF combosPossible integrationwithenvironmentcombosPossible integrationwithoptocombosMEMS & Sensors transitioning towards 3 main Package HubAccelerometerGyroscopeMagnetometerINE RTIALDOF69 IMUENVIRONMENTALOpen Cavity HubGas/ParticlePressureTemp/HumidityMicr ophoneOPTICALO ptical HubVisible3D visionMulti spectral3 DProximity/ambientMEMS & Sensors : The inertial hubClosed Package HubAccelerometerGyroscopeMagnetometerDOF 69 IMUENVIRONMENTALOpen Cavity HubGas / ParticlePressureTemp/HumidityMicrophoneO PTICALO ptical HubVisible3D visionMulti spectral3 DProximity/ambientComplete integration has been achieved at sensor levelStrong miniaturization race Still some developments on power consumption, advanced packagingMajor developments at Software level to achieve sensor fusion Accurate data acquisition Precise tracking within the environmentInertial Bill Of Materials $1 mems & Sensors .

3 The optical hubClosed Package HubAccelerometerGyroscopeMagnetometerINE RTIALDOF69 IMUENVIRONMENTALOpen Cavity HubGas / ParticlePressureTemp/HumidityMicrophoneO ptical HubVisible3D visionMulti spectral3 DProximity/ambientAn ever growing marketImaging is highly valuedThe imaging industry stopped the low cost/high integration model by increasing the pixel size and thus the die sizeImagingBill Of Materials $10 mems & Sensors : The environmental hubClosed Package HubAccelerometerGyroscopeMagnetometerINE RTIALDOF69 IMUOpen Cavity HubGas / ParticlePressureTemp/HumidityMicrophoneO PTICALO ptical HubVisible3D visionMulti spectral3 DProximity/ambientInteresting way for the mems industry to gain value:More integration at environmental levelPressure + MicrophoneAdd Particles & Gas detection (market pull) EnvironmentalBill Of Materials $ Of Materials $ marketby application Consumer isstillthe main driver$ $2 $4 $6 $8 $10 $12 $14 $16 $18 $20 2016-21$MMEMS $M forecast per application 2016 Yole D veloppement TelecomMedicalIndustrialDefenseConsumerA utomotiveAeronautics48% $B56% $BMEMS averagesellingpriceIs the marketable to absorbsucha pricedecrease?

4 $ $ $ $ $ $ $ $ $ 2020 mems ASP decreaseSource Yole D veloppementSmartphone waveCAGR-6%CAGR-13%New mems challenges Yesterday, the main mems challenges were size decrease, which in turn led to price decrease then volume growth. Today, trends are different. They are: importance of user case (start with the definition of an application), fusion different Sensors with software and power decrease (which paradoxically is linked to an chip size increase because of the ASIC)YesterdayASP decreaseConsumer volumeSize decrease2016, a new virtuous cycle?Power consumption decreaseImportance for user caseSensor fusion, software & more featuresMobileshavetosurviveforlongperio dsonbatterypowerwhileinteractingwithenvi ronment(voicecalls,Wi-Fi,Bluetooth,GPS, ).Start with applications, and work downwards to the chips needed to support , withmore intelligence!

5 Smarter or smaller? Two different paths in integration While some companies focus on developing smaller & smaller packaged dies, others prefer to go into another direction integrating more functions in the package. Winners are those that can merge both approaches: more functions in a reduced package!SMALLER (one sensor in a reduced package)SMARTER (more functions in a package)SWEET SPOT!Examples of mems companies with a Sensors integration road ( , mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo Sensors , AMS with optical combos, InvenSense with IMUs .. mems EvolutionMEMS die Ceramic packageWire BondingMEMS accelerometer ceramic package(Courtesy of MEMSIC)ASICCapMEMS SensorMEMS accelerometer plastic package with Wafer-Level capping (Courtesy of BOSCH) mems accelerometer in 3D WLCSP package with TGV (Courtesy of VTI / Murata)PASTTODAY wafer LevelcappingcombinedwithVertical interconnection wafer to wafer bonding WLCSPMEMS die is put in a ceramic or metal packageWafer LevelPackaging Reduced form factor Cost reduction Improved performanceWLP for microbolometersL3com mm34 mmULIS ceramic packaging (640x480))

6 20 mmBeforeConventionalmicrobolometers Ceramic or metal package The air is pumped out before the package is sealed with a silicon or germanium window Slow Costly metal packagingWLP microbolometers more chips can be packaged on the wafer cost reduced Vacuum sealing with a silicon widow in parallel at the wafer level improve throughput and yield sensor size reduced Cost reduced Vacuum or temperature resistance improvedWLP technologies3-Axis Accelerometer Package size comparison TSV Inside!Surface: SST= 4mm Package thickness: TST= 1mmSurface: SmCube= 4mm Package thickness: TmCube= : SBosch= Package thickness: TBosch= : SmCube= 4mm Package thickness: TmCube= : SmCube= 2,56mm Package thickness: TmCube= : SmCube= 1,21mm Package thickness: TmCube= packageLGA packageLGA packageWLCSPWLCSPLGA packageoDrivenby IoTWLP willbeone of the nextkey trend for mems and Sensorsdevices!

7 Source: mCube70% reductionin package size enabledby 3D TSV and WLPO ther mems & Sensors using TSV & WLP !ALS(Ambiant Light sensor )IMU6-Axis Accelerometer2015 OscillatorAnd muchmoreto come!TSV etchwithDRIE (Silex Microsystems process)PolysiliconsubstrateoTSV diameter6 moTSV Depth100 mLGA package typeTSV etchwithDRIE TSV filledwithdopedpolysiliconoTSV depth150 moTSV diamter6 mTSV -VIA LAST diameter80 moTSV depth200 -VIA Middle diameter10 moTSV depth85 moSimilareAR as Siliconinterposer (2,5D)oCu bottom-up fillingisusedlikein TSV memory manufacturing201520152010 FingerPrintSensorConclusionsConclusions and future perspectives mems & sensorsare facinga strongdemanddrivenby the consumer and costpressure wafer Level packaging significantly reduces the sensor sizeand has an impact on the cost and performance New mems architectures are more and more required to achieve higher features and functionalities in smaller footprint Therefore, WLP and TSV are the key packaging technologies enablingto achieveinnovativefunctions, higherperformances as wellas costeffective integrationThank you for your attention!

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