MICROC-SERIES - ON Semiconductor

1 DATA Semiconductor Components Industries, LLC, 2014 August, 2021 Rev. 81 Publication Order Number:MICROC SERIES/DSilicon Photomultipliers(SiPM), Low-Noise,Blue-SensitiveC-Series SiPM SensorsThe C Series low-light sensors from onsemi feature anindustry-leading low dark-count rate combined with a high PDE. Forultrafast timing applications, C Series sensors have a fast output thatcan have a rise time of 300 ps and a pulse width of 600 ps. TheC Series is available in different sensor sizes (1 mm, 3 mm and 6 mm)and packaged in a 4-side tileable surface mount (SMT) package that iscompatible with industry standard, lead-free, reflow C Series Silicon Photomultipliers (SiPM) form a range of highgain, single-photon sensitive, UV-to-visible light sensors. They haveperformance characteristics similar to a conventional PMT, whilebenefiting from the practical advantages of solid -state technology: lowoperating voltage, excellent temperature stability, robustness,compactness, output uniformity, and low cost.

2 For advice on the usageof these sensors please refer to the Biasing and Readout 1. PERFORMANCE PARAMETERS SensorSizeMicrocell SizeParameter (Note 1) , 20m, 35m Breakdown Voltage (Vbr) (Note 3) , 35m, 50m6mm35m1mm10m, 20m, 35m Recommended overvoltage Range (Voltage above Vbr) (Note 2) , 35m, 50m6mm35m1mm10m, 20m, 35m Spectral Range (Note 4)300950nm3mm20m, 35m, 50m6mm35m1mm10m, 20m, 35m Peak Wavelength (lp)420nm3mm20m, 35m, 50m6mm35mFigure 1. C Series SensorsSee detailed ordering and shipping information on page 14 ofthis data INFORMATIONC Series SiPM 1. PERFORMANCE PARAMETERS (continued) (Note 1)Microcell Size1mm10m PDE (Note 5) at lpVbr + V14%20m24%35m31%1mm10mVbr + V18%20m31%35m41%3mm20mVbr + V24%35m31%50m35%3mm20mVbr + V31%35m41%50m47%6mm35mVbr + V31%6mm35mVbr + V41%1mm10m Gain (anode to cathode readout)Vbr + V2 10520m1 10635m3 1063mm20m1 10635m3 10650m6 1066mm35m3 1061mm10m Dark Current (Note 6)Vbr + V13nA20m516nA35m1549nA3mm20m50142nA35m15 4443nA50m319914nA6mm35m6181750nAC Series SiPM 1.

3 PERFORMANCE PARAMETERS (continued) (Note 1)Microcell Size1mm10m Dark Count RateVbr + V3096kHz20m3096kHz35m3096kHz3mm20m300860 kHz35m300860kHz50m300860kHz6mm35m1200340 0kHz1mm10m, 20m, 35m Rise Time Fast Output (Note 7) , 35m, , 20m, 35m Signal Pulse Width Fast Output (FWHM) , 35m, Microcell recharge time constant (Note 8)5ns20m23ns35m82ns3mm20m23ns35m82ns50m1 59ns6mm35m95ns1mm10m Capacitance (Note 9) (anode cathode)Vbr + V50pF20m90pF35m100pF3mm20m770pF35m850pF5 0m920pF6mm35m3400pF1mm10m Capacitance (Note 9) (fast terminal to cathode)Vbr + V1pF20m1pF35m1pFC Series SiPM 1. PERFORMANCE PARAMETERS (continued) (Note 1)Microcell Size3mm20m Capacitance (Note 9) (fast terminal to cathode)Vbr + V20pF35m12pF50m7pF6mm35m48pF1mm10m, 20m, 35mTemperature dependence of C3mm20m, 35m, 50m6mm35m1mm10m, 20m, 35mTemperature dependence of Gain (Note 10) C3mm20m, 35m, 50m6mm35m1mm10m CrosstalkVbr + AfterpulsingVbr + All measurements made at V overvoltage and 21 C unless otherwise Please consult the maximum current levels on page 6 when selecting the overvoltage to The breakdown voltage (Vbr) is defined as the value of the voltage intercept of a straight line fit to a plot of I vs V, where I is the current andV is the bias The range where PDE > 1% at Vbr + Note that the PDE does not contain contributions from afterpulsing or Dark current derived from dark count data as DC M q (1 + CT)

4 , where DC is dark count, M is gain, q is the charge of an electron, andCT is cross Measured as time to go from 10% to 90% of the peak RC charging time constant of the microcell (t)9. Internal capacitance of the sensor . Typically add 2 3 pF for sensor in package. Listed by unique microcell size for each part Quoted as the percentage change per degree C from the measured value at 21 Series SiPM PARAMETERST able 2. GENERAL PARAMETERS 1 mm3 mm6 mm10010, 10020, 1003530020, 30035, 3005060035 Active area1 1 mm23 3 mm26 6 mm2 No. of microcells10010: 288010020: 129610035: 50430020: 1099830035: 477430050: 266860035: 18980 Microcell fill factor10010: 28%10020: 48%10035: 64%30020: 48%30035: 64%30050: 72%60035: 64%Table 3. PACKAGE PARAMETERS 1 mm3 mm6 mm10010, 10020, 1003530020, 30035, 3005060035 Package mm24 4 mm27 7 mm2 Recommended operating temperature range 40 C to +85 C Maximum storage temperature+105 C Soldering conditionsLead free, reflow soldering process compatible(MSL 3 for tape & reel quantities; MSL 4 for tape only qty.)

5 See the SMT Handling Te c h Note for more details. Encapsulant typeClear transfer molding compound Encapsulant refractive @ 420 nmTable 4. MAXIMUM CURRENT LEVELS FOR EACH sensor SIZE1 mm3 mm6 mm10010, 10020, 1003530020, 30035, 30050600356mA15 mA20 mAC Series SiPM SCHEMATICSAn SiPM is formed of a large number (hundreds orthousands) of microcells. Each microcell is an avalanchephotodiode with its own quench resistor and a capacitivelycoupled fast output. These microcells are arranged ina close-packed array with all of the like terminals ( all ofthe anodes) summed together. The array of microcells canthus be considered as a single photodiode sensor with threeterminals: anode, cathode and fast 2. Circuit SchematicSimplified circuit schematic of the SensL SiPM showingonly a 12 microcell example. Typically, SiPM sensors have hundreds or thousands of schematic of the SensL SiPM microcell, showing details of the Fast SiPM component Series SiPM 3.

6 PDE versus Wavelength (MicroFC 30035 SMT)Figure 4. Responsivity versus Wavelength(MicroFC 30035 SMT)C Series SiPM 5. PDE at 420 nm versus VoltageFigure 6. Dark Count Rate versus OvervoltageFigure 7. Gain versus OvervoltageFigure 8. Dark Current versus Voltage and TemperatureC Series SiPM BOARD OPTIONSSMA Biasing Board (MicroFC SMA XXXXX)The MicroFC SMA is a printed circuit board (PCB) thatcan facilitate the evaluation of the C Series SMT board has three female SMA connectors for connectingthe bias voltage, the standard output from the anode and thefast output signal. The output signals can be connecteddirectly to a 50W-terminated oscilloscope for viewing. Thebiasing and output signal tracks are laid out in such a way asto preserve the fast timing characteristics of the MicroFC SMA is recommended for users whorequire a plug-and-play set-up to quickly evaluate C SeriesSMT sensors with optimum timing performance.

7 The boardalso allows the standard output from the anode-cathodereadout to be observed at the same time as the fast outputs can be connected directly to the oscilloscope ormeasurement device, but external preamplification may berequired to boost the signal. The table below lists the SMAboard connections. The SMA board electrical schematicsare available to download in AND9809 9. SMA Biasing BoardMicroFC SMA XXXXXO utputFunctionVbias Positive bias input (cathode)Fout Fast outputSout Standard output (anode)Pin Adapter (MicroFC SMTPA XXXXX)The SMT Pin Adapter board (SMTPA) is a small PCBboard that houses the SMT sensor and has through-hole pinsto allow for use with standard sockets or probe clips. Thisproduct is useful for those needing a quick way to evaluatethe C Series SMT sensors without the need for specialistsurface-mount soldering. While this is a quick fix suitablefor many evaluations, it should be noted that the timingperformance from this board will not be optimized and if thebest possible timing performance is required, theMicroFC SMA XXXXX is recommended.

8 The pin-outinformation is shown in the table below. The SMTPA boardelectrical schematics are shown in Figure 12 and areavailable to download in AND9809 10. Pin AdapterFigure 11. MicroFC SMTPA XXXXXF igure 12. SMTPA Board Circuit SchematicMicroFC SMTPA XXXXXPin output3 Cathode4 Ground5No connectC Series SiPM DIMENSIONS(All Dimensions in mm)MicroFC 60035 SMTTOP VIEWBOTTOM VIEWSIDE VIEWPin AssignmentsPin #MicroFC 60035 SMT1 Anode2 Fast Output3 Cathode4, 5 No Connect**The No Connect pin 4 should be soldered to the PCB. This pin can be connected to ground but it can also be left floating without affectingthe dark noise. It is recommended that the Pin 5 paddle is NOT soldered to the PCB and is left floating to achieve optimal soldering on pins1 to 4. Please note the full advice in the CAD complete MicroFC 60035 SMT POD is available to download Series SiPM DIMENSIONS(All Dimensions in mm)MicroFC 30020 SMT, MicroFC 30035 SMT, MicroFC 30050 SMT*The No Connect pin 4 should be soldered to the PCB.

9 It can be connected to ground but it can also be left floating without affecting the VIEWBOTTOM VIEWSIDE VIEWPin AssignmentsPin #MicroFC 300XX SMT1 Anode2 Fast Output3 Cathode4 No Connect*The complete MicroFC 300xx SMT POD is available to download Series SiPM DIMENSIONS(All Dimensions in mm)MicroFC 10010 SMT, MicroFC 10020 SMT & MicroFC 10035 SMT*The No Connect pin 4 should be soldered to the PCB. It can be connected to ground but it can also be left floating without affecting the VIEWBOTTOM VIEWSIDE VIEWPin AssignmentsPin #MicroFC 100XX SMT1 Anode2 Fast Output3 Cathode4 No Connect*The complete MicroFC 100XX SMT POD is available to download Series SiPM DIMENSIONS(All Dimensions in mm)MicroFC SMTPA BoardTOP VIEWBOTTOM VIEWSIDE VIEWThe electrical schematics for the SMTPA board is available in AND9809 SMA BoardTOP VIEWBOTTOM VIEWSIDE VIEWThe electrical schematics for the SMA board is available in AND9809 Series SiPM LINKS Introduction to Silicon Photomultipliers Application Note If you are new to SiPM, this document explains theiroperation and main performance parameters.

10 Biasing and Readout Application Note This document gives detailed information on how to bias the sensor for bothstandard and fast configurations, and amplifying and reading out the signal. How to Evaluate and Compare Silicon Photomultipliers Application Note Information on what to consider whenselecting an SiPM. Handling and Soldering Guide This document gives information on safe handling of the sensors and soldering to INFORMATIONT able 5. ORDERING INFORMATION Product Code(Note 11)Microcell Size(Total Number)SensorActive AreaPackage TypeDeliveryOptions(Note 12)10000 SeriesMICROFC 10010 SMT10mm(2880 microcells)1 mm 1mm4-side tileable, surface mount package(SMT)TR1, TRMICROFC SMA 10010 GEVBSMT sensor mounted onto a PCB withSMA connectors for bias and SMTPA 10010 GEVBSMT sensor mounted onto a pinadapter 10020 SMT20mm(1296 microcells)4-side tileable, surface mount package (SMT)TR1, TRMICROFC SMA 10020 GEVBSMT sensor mounted onto a PCB withSMA connectors for bias and SMTPA 10020 GEVBSMT sensor mounted onto a pinadapter 10035 SMT35mm(576 microcells)4-side tileable, surface mount package (SMT)TR1, TRMICROFC SMA 10035 GEVBSMT sensor mounted onto a PCB withSMA connectors for bias and SMTPA 10035 GEVBSMT sensor mounted onto a pinadapter Series SiPM 5.