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MICROJ-SERIES - ON Semiconductor

DATA Semiconductor Components Industries, LLC, 2017 August, 2021 Rev. 71 Publication Order Number:MICROJ SERIES/DSilicon Photomultipliers(SiPM), High PDE andTiming Resolution Sensorsin a TSV PackageJ-Series SiPM Sensorsonsemi s J-Series low-light sensors feature a high PDE (photondetection efficiency) that is achieved using a high-volume, P-on-Nsilicon foundry process. The J-Series sensors incorporate majorimprovements in the transit time spread which results in a significantimprovement in the timing performance of the sensor. J-Series sensorsare available in different sizes (3 mm, 4 mm and 6 mm) and use a TSV(Through Silicon Via) process to create a package with minimaldeadspace, that is compatible with industry standard lead-free, reflowsoldering J-Series Silicon Photomultipliers (SiPM) combine highperformance with the practical advantages of solid-state technology:low operating voltage, excellent temperature stability, robustness,compactness, output uniformity, and low cost.

*Please refer to the TSV Handling and Soldering guide for more information on MSL for different delivery options. J ... EVALUATION BOARD OPTIONS SMA BIASING BOARD (MicroFJ−SMA−XXXXX) The MicroFJ−SMA is a printed circuit board (PCB) that can facilitate the evaluation of the J-Series sensors. The board has three female SMA connectors for ...

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Transcription of MICROJ-SERIES - ON Semiconductor

1 DATA Semiconductor Components Industries, LLC, 2017 August, 2021 Rev. 71 Publication Order Number:MICROJ SERIES/DSilicon Photomultipliers(SiPM), High PDE andTiming Resolution Sensorsin a TSV PackageJ-Series SiPM Sensorsonsemi s J-Series low-light sensors feature a high PDE (photondetection efficiency) that is achieved using a high-volume, P-on-Nsilicon foundry process. The J-Series sensors incorporate majorimprovements in the transit time spread which results in a significantimprovement in the timing performance of the sensor. J-Series sensorsare available in different sizes (3 mm, 4 mm and 6 mm) and use a TSV(Through Silicon Via) process to create a package with minimaldeadspace, that is compatible with industry standard lead-free, reflowsoldering J-Series Silicon Photomultipliers (SiPM) combine highperformance with the practical advantages of solid-state technology:low operating voltage, excellent temperature stability, robustness,compactness, output uniformity, and low cost.

2 For more informationon the J-Series sensors please refer to the 1. GENERAL PARAMETERS Parameter (Note 1)MinimumTypicalMaximumUnit Breakdown Voltage (Vbr) (Note 2) Overvoltage (OV)16V Operating Voltage (Vop = Vbr + OV)) Spectral Range (Note 3)200900nm Peak PDE Wavelength (lp)420nm Temperature dependence of C1. All measurements made at 21 C unless otherwise The breakdown voltage (Vbr) is defined as the value of the voltage intercept of a straight line fit to a plot of I vs V, where I is the current andV is the bias The range where PDE > at Vbr + 2. PHYSICAL PARAMETERS Parameter3 mm4 mm6 mm30020, 300354003560035 Active mm2 No. of Microcells30020: 14,41030035: 5,67640035: 9,26060035: 22,292 Microcell Fill Factor30020: 62%30035: 75%40035: 75%60035: 75%See detailed ordering and shipping information on page 11 ofthis data INFORMATIONJ Series SiPM 3. PERFORMANCE PARAMETERSP arameter (Note 4)300354003560035 UnitOvervoltageUnit+ V+6 V+ V+6 V+ V+6 VPDE (Note 5)385038503850%Dark Count Rate501505015050150kHz/mm2 Gain (anode-cathode) 106 Dark Current Current Time (Note 6) anode-cathode output9011090110180250psMicrocell Recharge Time Constant (Note 7)454850nsCapacitance (Note 8) (anode output)107018004140pFCapacitance (Note 8) (fast output)4070160pFFast Output Pulse Width (FWHM) (Note 4)30020 UnitOvervoltage+ V+5 VPDE (Note 5)3038%Dark Count Rate50125kHz/mm2 Gain (anode-cathode) 106 Dark Current Current Time (Note 6) anode-cathode output130160psMicrocell Recharge Time Constant (Note 7)15nsCapacitance (Note 8) (anode output)1040pFCapacitance (Note 8) (fast output)50pFFast Output Pulse Width (FWHM)

3 All measurements made at 21 C unless otherwise PDE does not contain afterpulsing or crosstalk, and is quoted at the peak wavelength (lp).6. Measured as time to go from 10% to 90% of the peak amplitude and measured over a 1W series output RC charging time constant of the microcell ( ).8. Capacitance values are for the complete TSV 4. TVS PACKAGE SPECIFICS 3 mm4 mm6 mm30020, 300354003560035 Package mm2 Recommended Operating Temperature Range 40 C +85 C Soldering ConditionsReflow Solder Cover MaterialGlass Cover Refractive @ 436 nm Moisture Sensitivity Level Tape & reelMSL3* Cut tapeMSL4* Maximum Average Current10 mA10 mA15 mA*Please refer to the TSV handling and Soldering guide for more information on MSL for different delivery Series SiPM PLOTSF igure 1. Photon Detection Efficiency (PDE)(MicroFJ 60035 TSV)Figure 2. PDE vs. Overvoltage(MicroFJ 60035 TSV)Figure 3. PDE vs. Crosstalk(MicroFJ 60035 TSV)J Series SiPM 4.

4 Gain vs. Overvoltage(MicroFJ 30035 TSV)Figure 5. Fast Output Pulse Shape(MicroFJ 30035, MicroFJ 40035, MicroFJ 60035 Vbr + V, 10 W Sense Resistor)Figure 6. Standard Output Pulse Shape(MicroFJ 30035, MicroFJ 40035, MicroFJ 60035 Vbr + V, 10 W Sense Resistor)J Series SiPM board OPTIONSSMA BIASING board (MicroFJ SMA XXXXX)The MicroFJ SMA is a printed circuit board (PCB) thatcan facilitate the evaluation of the J-Series sensors. Theboard has three female SMA connectors for connecting thebias voltage, the standard output from the anode and the fastoutput signal. The output signals can be connected directlyto a 50W-terminated oscilloscope for viewing. The biasingand output signal tracks are laid out in such a way as topreserve the fast timing characteristics of the MicroFJ SMA is recommended for users whorequire a plug-and-play set-up to quickly evaluate J-SeriesTSV sensors with optimum timing performance. The boardalso allows the standard output from the anode to beobserved at the same time as the fast output.

5 The outputs canbe connected directly to the oscilloscope or measurementdevice, but external preamplification may be required toboost the signal. The table below lists the SMA boardconnections. The SMA board electrical schematics areavailable to download in the AND9808/D SMA XXXXXO utputFunctionVbiasPositive bias input (cathode)FoutFast outputSoutStandard output (anode)PIN ADAPTER (MicroFJ SMTPA XXXXX)The TSV Pin Adapter board (SMTPA) is a small PCBboard that houses the TSV sensor and has through-hole pinsto allow its use with standard sockets or probe clips. Thisproduct is useful for those needing a quick way to evaluatethe TSV package without the need for specialistsurface-mount soldering. While this is a quick fix suitablefor many evaluations, it should be noted that the timingperformance from this board will not be optimized and if thebest possible timing performance is required, theMicroFJ SMA XXXXX is recommended.

6 The SMTPA circuit schematic is shown in Figure 8. Please consult theReadout and Biasing Application Note for furtherinformation on biasing. The SMTPA board electricalschematics are available to download in the AND9808 7. Top View of the SMTPA BoardShowing the Pin NumberingFigure 8. SMTPA circuit SchematicMicroFJ SMTPA XXXXXPin output3 Cathode4 Ground5No connectJ Series SiPM SCHEMATICSAn SiPM is formed of a large number (hundreds orthousands) of microcells. Each microcell (Figure 9) is anavalanche photodiode with its own quench resistor and acapacitively coupled fast output. These microcells arearranged in a close-packed array with all of the like terminals( all of the anodes) summed together (Figure 10). Thearray of microcells can thus be considered as a singlephotodiode sensor with three terminals: anode, cathode andfast output, as shown in Figure 9. circuit Schematic of the onsemiSiPM Microcell, showing Details of theFast OutputFigure 10.

7 Simplified circuit Schematic of the onsemiSiPM showing only a 12 Microcell Example. Typically,SiPM Sensors have Hundreds or Thousands ofMicrocellsFigure 11. onsemi SiPM Component SymbolTILING OF THE TSV PACKAGEFor the J-Series, onsemi has developed a market-leading,high-performance package using a TSV process. It isa chip-scale package that is compatible with lead-free,reflow soldering processes. The glass cover is ideal forcoupling to scintillators or fibre optic dead-space between the sensor active area and theedge of the package has been minimized, resulting ina package that can be tiled on 4 sides with high allows multiple sensors to be configured into uniquelayouts for a wide range of custom applications. Thedistance between sensor packages can be as little as 200mmwhen tiled, but actual alignment and placement toleranceswill depend on the accuracy of the user s assembly Application Note is available that gives advice oncreating arrays of the TSV Series SiPM DIMENSIONS(All Dimensions in mm)MicroFJ 300XX TSV*The No Connect pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat outputA1, C3 CathodeAll othersNo Connect*Pin NumberMicroFJ 300XX TSVTOP VIEWSIDE VIEWBOTTOM VIEWPin AssignmentsThe MicroFJ 300XX TSV A2 CAD, and solder footprint, is available to download Series SiPM DIMENSIONS(All Dimensions in mm)MicroFJ 40035 TSV*The No Connect pins are electrically isolated and should be soldered to a ground (or bias)

8 Plane to help with heat , C1 AnodeB4, C4 Fast outputA1, D4 CathodeAll othersNo Connect*Pin NumberMicroFJ 40035 TSVTOP VIEWSIDE VIEWBOTTOM VIEWPin AssignmentsThe MicroFJ 40035 TSV CAD, and solder footprint, is available to download Series SiPM DIMENSIONS(All Dimensions in mm)MicroFJ 60035 TSV*The No Connect pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat , D1 AnodeA1, F6 CathodeC6, D6 Fast outputAll othersNo Connect*Pin NumberMicroFJ 60035 TSVTOP VIEWSIDE VIEWBOTTOM VIEWPin AssignmentsThe MicroFJ 60035 TSV CAD, and solder footprint, is available to download Series SiPM SMA 60035 BoardSIDE VIEWTOP VIEWBOTTOM VIEWThe complete CAD for the SMA boards can be downloaded from the website: 3 mm, 4 mm and 6 mm SMTPA 60035 BoardBOTTOM VIEWSIDE VIEWTOP VIEWThe complete CAD for the SMTPA boards can be downloaded from the website: 3 mm and 6 mm Series SiPM INFORMATIONT able 5. ORDERING INFORMATIONP roduct CodeMicrocell Size(No.)

9 Of Microcells)SensorActiveAreaDescriptionDe liveryOption(Note 9)3 mm SensorsMICROFJ 30020 TSV20 mm(14,410) mm4-side tileable, chip scale package withthrough-silicon vias (TSV)TR1, TRMICROFJ SMA 30020 GEVBTSV sensor mounted onto a PCB withthree SMA connectors for bias, standardoutput and fast outputPKMICROFJ SMTPA 30020 GEVBTSV sensor mounted onto a pin adapterboardPKMICROFJ 30035 TSV35 mm(5,676)4-side tileable, chip scale package withthrough-silicon vias (TSV)TR1, TRMICROFJ SMA 30035 GEVBTSV sensor mounted onto a PCB withthree SMA connectors for bias, standardoutput and fast outputPKMICROFJ SMTPA 30035 GEVBTSV sensor mounted onto a pin adapterboardPK4 mm SensorsMICROFJ 40035 TSV35 mm(9,260) mm4-side tileable, chip scale package withthrough-silicon vias (TSV)TR1, TRMICROFJ SMA 40035 GEVBTSV sensor mounted onto a PCB withthree SMA connectors for bias, standardoutput and fast mm SensorsMICROFJ 60035 TSV35 mm(22,292) mm4-side tileable, chip scale package withthrough-silicon vias (TSV)TR1, TRMICROFJ SMA 60035 GEVBTSV sensor mounted onto a PCB withthree SMA connectors for bias, standardoutput and fast outputPKMICROFJ SMTPA 60035 GEVBTSV sensor mounted onto a pin adapterboardPK9.

10 The two-letter delivery option code should be appended to the order number, ) to receive a MICROFJ 60035 TSV on tape and reel, useMICROFJ 60035 TSV TR. The codes are as follows:PK = ESD PackageTR1 = TapeTR = Tape and ReelThere is a minimum order quantity (MOQ) of 3000 for the tape and reel (TR) option. Quantities less than this are available on tape ( TR1).The TR option is only available in multiples of the is a registered trademark of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the UnitedStates and/or other , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliatesand/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual listing of onsemi s product/patent coverage may be accessed at onsemi reserves the right to make changes at any time to anyproducts or information herein, without notice.


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