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NCP4306 - Secondary Side Synchronous Rectification Driver ...

data Semiconductor Components Industries, LLC, 2017 January, 2022 Rev. 81 Publication Order Number: NCP4306 /DSecondary SideSynchronous RectificationDriver for High EfficiencySMPS TopologiesNCP4306 The NCP4306 is high performance Driver tailored to control asynchronous Rectification MOSFET in switch mode power to its high performance drivers and versatility, it can be used invarious topologies such as DCM or CCM flyback, quasi resonantflyback, forward and half bridge resonant combination of externally or fixed adjustable minimumoff-time and on-time blanking periods helps to fight the ringinginduced by the PCB layout and other parasitic elements.

this data sheet. ORDERING INFORMATION DFN8, 4x4 CASE 488AF DFN8, 2.0x2.2, 0.5P CASE 506BP 1 8 1 XXXXXX XXXXXX ALYW XXM 1 DFN8, 4x4 DFN8, 2.0x2.2, 0.5P See detailed marking information on page 2 of this data sheet. MARKING DIAGRAMS

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Transcription of NCP4306 - Secondary Side Synchronous Rectification Driver ...

1 data Semiconductor Components Industries, LLC, 2017 January, 2022 Rev. 81 Publication Order Number: NCP4306 /DSecondary SideSynchronous RectificationDriver for High EfficiencySMPS TopologiesNCP4306 The NCP4306 is high performance Driver tailored to control asynchronous Rectification MOSFET in switch mode power to its high performance drivers and versatility, it can be used invarious topologies such as DCM or CCM flyback, quasi resonantflyback, forward and half bridge resonant combination of externally or fixed adjustable minimumoff-time and on-time blanking periods helps to fight the ringinginduced by the PCB layout and other parasitic elements.

2 A reliable andnoise less operation of the SR system is insured due to the SelfSynchronization feature. The NCP4306 also utilizes Kelvinconnection of the Driver to the MOSFET to achieve high efficiencyoperation at full load and utilizes a light load detection architecture toachieve high efficiency at light precise turn off threshold, extremely low turn off delay timeand high sink current capability of the Driver allow the maximumsynchronous Rectification MOSFET conduction time and enablesmaximum SMPS efficiency. The high accuracy Driver and 5 V gateclamp enables the use of GaN Self Contained Control of Synchronous Rectifier in CCM, DCM andQR for Flyback or LLC Applications Precise True Secondary Zero Current Detection Typically 15 ns Turn off Delay from Current Sense Input to Driver Rugged Current Sense Pin (up to 200 V) Ultrafast Turn off Trigger Interface / Disable Input ( ns)

3 Adjustable or Fixed Minimum ON Time Adjustable or Fixed Minimum OFF-Time with Ringing Detection Improved Robust Self Synchronization Capability 7 A / 2 A Peak Current Sink / Source Drive Capability Operating Voltage Range up to VCC = 35 V Automatic Light load Disable Mode GaN Transistor Driving Capability Low Startup and Disable Current Consumption Maximum Operation Frequency up to 1 MHz TSOP6, SOIC8, DFN8 4x4 and DFN8 Packages This is a Pb Free DeviceTypical Applications Notebook Adapters High Power Density AC / DC Power Supplies (Cell Phone Chargers) LCD TVs All SMPS with High Efficiency RequirementsSOIC 8 NBCASE 751 07 TSOP 6 CASE 318G 0218 XXXXX = Specific Device CodeA= Assembly LocationL= Wafer LotY= YearW= Work WeekM= Date CodeG= Pb Free PackageXXXXXXXXALYWX G18 XXXAYWGG1(Note: Microdot may be in either location)1 SOIC 8 NBTSOP 6 See detailed ordering and shipping information on page 2 ofthis data INFORMATIONDFN8, 4x4 CASE 488 AFDFN8, , 506BP181 XXXXXXXXXXXXALYWGGXXMGG1 DFN8, 4x4 DFN8, , detailed marking information on page 2 of thisdata INFORMATION TABLET able 1.

4 AVAILABLE DEVICES DevicePackage MarkingPackageShipping NCP4306 AAAZZZADR2G6 AAAZZZASOIC 8(Pb Free)2500 / Tape and ReelNCP4306 AADZZZADR2G6 AADZZZANCP4306 AAHZZZADR2G6 AAHZZZANCP4306 DADZZDASNT1G6 ACTSOP 6(Pb Free)3000 / Tape and ReelNCP4306 DAHZZAASNT1G6 ADNCP4306 DADZZBASNT1G6 AKNCP4306 AAAZZZAMNTWG4306 AAAZZZADFN 8 4x4(Pb Free)4000 / Tape and ReelNCP4306 AADZZZAMNTWG4306 AADZZZANCP4306 AAAZZZAMN1 TBG6 ADFN 8 (Pb Free)3000 / Tape and ReelNCP4306 AADZZZAMN1 TBG6D For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecification Brochure, BRD8011 the onsemi Device Nomenclature document (TND310/D) for a full description of the naming convention used for imagesensors.

5 For reference documentation, including information on evaluation kits, please visit our web site at 1. Typical Application Example LLC Converter with optional LLD and Trigger Utilization+VBULKLLCSTAGECONTROLM1M2N1C1 OK1N3N2Tr1R1C3+ 2. Typical Application Example DCM, CCM or QR Flyback Converter with optional LLD and disabled TRIGVBULKFLYBACKCONTROLCIRCUITRYM1C1OK1R 1D3C2TR1R3M2 GNDC4D5 NCP4306 RMIN_TOFFRLLDR2 DRVCSFBVCCC3D4C5 MIN_TOFFMIN_TONLLD+VOUTVBULKFLYBACKCONTR OLCIRCUITRYM1C1OK1R1D3C2TR1R3M2 GNDC4D5 NCP4306 RMIN_TONRLLDR2 DRVCSFBVCCC3D4C5 VCCDRVGNDCSTRIG+VOUTF igure 3. Typical Application Example DCM, CCM or QR Flyback Converter with NCP4306 in TSOP6 (v Cxxxxxx)VBULKC1R1D3C2TR1 FLYBACKCONTROLCIRCUITRYM1 DRVCSFBVCCC3OK1M2D4R3C4 GNDC5D5 NCP4306 RMIN_TOFFRLLD+ 4.

6 Typical Application Example Primary Side Flyback Converter and NCP4306 in TSOP6 VBULKC1R1D3C2TR1C6M2R5C8 GND+VOUTC7R3R4C5C4R3 ZCDC3D4 VCCDRVM1R2 CSCOMPVCCMIN_TOFFGNDCSDRVMIN_TONNCP4306 RMIN_TOFFRMIN_TONPRIMARYSIDEFLYBACKCONTR OLLERPIN FUNCTION DESCRIPTIONT able 2. PIN FUNCTION DESCRIPTION TSOP6 BxxxxxxTSOP6 CxxxxxxTSOP6 DxxxxxxTSOP6 ExxxxxxTSOP6 FxxxxxxTSOP6 GxxxxxxSOIC8,DFN8 AxxxxxxPin NameDescription6666661 VCCS upply voltage pin 555 2 MIN_TOFFA djust the minimum off timeperiod by connecting resistor toground5 4 5 3 MIN_TONA djust the minimum on timeperiod by connecting resistor toground44 44 LLDThis input modulates the driverclamp level and / or turns the driv-er off during light load conditions 4455 TRIG / DISU ltrafast turn off input that can beused to turn off the SR MOSFETin CCM applications in order toimprove efficiency.

7 Activatesdisable mode if pulled up formore than 100 s3333336 CSCurrent sense pin detects if thecurrent flows through the SRMOSFET and / or its body diode2222227 GNDG round connection for the SRMOSFET Driver and VCCdecoupling capacitor. Groundconnection for minimum tON andtOFF adjust resistors, LLD andtrigger pin should be wired directlyto the SR MOSFET sourceterminal / soldering point usingKelvin connection. DFN8 exposedflag should be connected to output for the SR 5. Internal Circuit Architecture NCP4306 Minimum ON timegeneratorMIN_TONCS detectionCSMIN_TOFFTRIG/DISDRVVCCGNDVCC managmentUVLODRIVERVDDLLDD isable detectionELAPSEDENM inimum OFFtime generatorRESETELAPSEDC ontrol logicENDISABLED isable detectionDISABLEDISABLETRIGdV/dtExceptio n timegeneratorENELAPSED10 MAXIMUM RATINGST able 3.

8 ABSOLUTE MAXIMUM RATINGS RatingSymbolValueUnitSupply VoltageVCC to / DIS, MIN_TON, MIN_TOFF, LLD Input Voltage (Note 3)VTRIG / DIS, VMIN_TON, VMIN_TOFF, VLLD to VCCVD river Output VoltageVDRV to Sense Input VoltageVCS 4 to 200 VCurrent Sense Dynamic Input Voltage (tPW = 200 ns)VCS_DYN 10 to 200 VMIN_TON, MIN_TOFF, LLD, TRIG Input CurrentIMIN_TON, IMIN_TOFF, ILLD, ITRIG 10 to 10mADRV Pin Current (tPW = 10 s)IDRV_DYN 3 to 12 AVCC Pin Current (tPW = 10 s)IVCC_DYN3 AJunction to Air Thermal Resistance, 1 oz 1 in2 Copper Area,SOIC8R J A_SOIC8200 C / WJunction to Air Thermal Resistance, 1 oz 1 in2 Copper AreaTSOP6R J A_TSOP6250 C / WJunction to Air Thermal Resistance, 1 oz 1 in2 Copper AreaDFN8 4x4R J A_DFN8_4x480 C / WJunction to Air Thermal Resistance, 1 oz 1 in2 Copper AreaDFN8 J C / WMaximum Junction TemperatureTJMAX150 CStorage TemperatureTSTG 60 to 150 CESD Capability, Human Body Model (except pin CS) (Note 1)ESDHBM2000 VESD Capability, Human Body Model Pin CSESDHBM600 VESD Capability, Machine Model (Note 1)

9 ESDMM200 VESD Capability, Charged Device Model (Note 1)ESDCDMC lass C3-Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be This device series contains ESD protection and exceeds the following tests:Except pin CS: Human Body Model 2000 V per JEDEC Standard JESD22 pins: Machine Model Method 200 V per JEDEC Standard JESD22 A115 ACharged Machine Model per JEDEC Standard JESD22 C101F2. This device meets latchup tests defined by JEDEC Standard If voltage higher than 22 V is connected to pin, pin input current increases.

10 Internal ESD clamp contains 24 V Zener diode with 3 k in is recommended to add serial resistance in case of higher input voltage to limit input pin 4. RECOMMENDED OPERATING CONDITION ParameterSymbolMinMaxUnitMaximum Operating VoltageVCC35 VOperating Junction TemperatureTJ 40125 CHARACTERISTICST able 5. ELECTRICAL CHARACTERISTICS 40 C TJ 125 C; VCC = 12 V; CDRV = 0 nF; RMIN_TON = RMIN_TOFF = 10 k or internally set values; VLLD = V or LLD internallydisabled; VTRIG / DIS = 0 V; VCS = 4 V, unless otherwise noted. Typical values are at TJ = +25 CParameterTest ConditionsSymbolMinTypMaxUnitSUPPLY SECTIONVCC UVLOVCC UVLO up DelayVCC rising from 0 to VCCON + 1 V @ tr= 10 stSTART_DEL5080 sCurrent Consumption,tMIN_TON = tMIN_TOFF = 1 s, tLLD = 130 sCDRV = 0 nF,fCS = 100 = 1 nF,fCS = 100 = 10 nF,fCS = 100 Consumption below UVLOVCC = VCCOFF VICC_UVLO3560 ACurrent Consumption in Disable Modet > tLLD , VLLD = VICC_DIS60100 AVTRIG / DIS = 5 V.


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