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NCP81295 - Hot Swap Smart Fuse - ON Semiconductor

Hot Swap Smart fuse NCP81295 , NCP81296. The NCP81295 and NCP81296 are 50 A, electronically re settable, in line fuses for use in 12 V, high current applications such as servers, storage and base stations. The NCP81295 /6 offers a very low mW. integrated MOSFET to reduce solution size and minimize power loss. It also integrates a highly accurate current sensor for monitoring and overload protection. Power Features Co packaged Power Switch, Hotswap Controller and Current Sense MARKING. DIAGRAM. Up to 60 A Peak Current Output, 50 A Continuous Vin Range: V to 18 V 1. mW, no RSENSE Required NCP8129x Control Features 1 32 AWLYYWWG. LQFN32 5x5, G. Enable Input CASE 487AA. Optional Enable controlled Output Pulldown when Disabled Programmable Soft Start NCP8129x = Specific Device Code Programmable, Multi level Current Limit x = 5 or 6. A = Assembly Location Reporting Features WL = Wafer Lot Accurate Analog Load Current Monitor YY = Year WW = Work Week Programmable Over Current Alert Output G = Pb Free Package Analog Temperature Output = (may or may not be present).

4.7 nF ceramic capacitor is reserved between this pin and GND for NCP81295 to mitigate the oscilla-tion risk when small amount of output capacitance (< 100 F) or long input/output cable (large LIN / LOUT) happens. 18 VTEMP Analog temperature monitor output. 19 SS Soft Start time programming pin.

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Transcription of NCP81295 - Hot Swap Smart Fuse - ON Semiconductor

1 Hot Swap Smart fuse NCP81295 , NCP81296. The NCP81295 and NCP81296 are 50 A, electronically re settable, in line fuses for use in 12 V, high current applications such as servers, storage and base stations. The NCP81295 /6 offers a very low mW. integrated MOSFET to reduce solution size and minimize power loss. It also integrates a highly accurate current sensor for monitoring and overload protection. Power Features Co packaged Power Switch, Hotswap Controller and Current Sense MARKING. DIAGRAM. Up to 60 A Peak Current Output, 50 A Continuous Vin Range: V to 18 V 1. mW, no RSENSE Required NCP8129x Control Features 1 32 AWLYYWWG. LQFN32 5x5, G. Enable Input CASE 487AA. Optional Enable controlled Output Pulldown when Disabled Programmable Soft Start NCP8129x = Specific Device Code Programmable, Multi level Current Limit x = 5 or 6. A = Assembly Location Reporting Features WL = Wafer Lot Accurate Analog Load Current Monitor YY = Year WW = Work Week Programmable Over Current Alert Output G = Pb Free Package Analog Temperature Output = (may or may not be present).

2 Status Fault OK Output (Note: Microdot may be in either location). Other Features 5 mm x 5 mm QFN32 Package PINOUT. Operating Temperature: 40 C to 125 C. 32. 31. 30. 29. 28. 27. 26. 25. Can be Paralleled for Higher Current Applications 1 24. Built in Insertion Delay for Hotswap Applications 2 23. NCP81295 /6. NCP81295 : Latch off for Following Protection Features 3 22. NCP81296: Auto Retry Mode for Following Protection Features 4 (TOP VIEW) 21. Current limit after Delay 5 20. Fast Short circuit Protection 6. 33 19. VIN. Over Temperature Shutdown 7 18. Excessive Soft start Duration 8 17. Internal Switch Fault Diagnostics 10. 11. 12. 13. 14. 15. 16. 9. Low power Auxiliary Output Voltage For more details see Figure 1. ORDERING INFORMATION. See detailed ordering and shipping information on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: April, 2020 Rev.

3 12 NCP81295 /D. NCP81295 , NCP81296. VOUT32. VOUT31. VOUT30. VOUT29. VOUT28. VOUT27. VOUT26. VOUT25. 32. 31. 30. 29. 28. 27. 26. 25. NC4 1 24 CLREF. NC5 2 23 CS. D_OC 3 22 IMON. NCP81295 /6. ON 4 21 VDD. (TOP VIEW). GOK 5 33 20 GND. VIN. NC1 6 19 SS. VINF 7 18 VTEMP. NC2 8 17 GATE. 10. 11. 12. 13. 14. 15. 16. 9. VIN9. VIN10. VIN11. VIN12. VIN13. VIN14. VIN15. VIN16. Figure 1. Pin Configuration Ordering Information Table 1. AVAILABLE DEVICES. Device Package Shipping . NCP81295 MNTXG QFN32 2500 / Tape & Reel NCP81296 MNTXG QFN32 2500 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 2. NCP81295 , NCP81296. System VIN. VIN VINF. GOK VDD. D_OC. fuse protected ON NCP81295 / 6 VOUT System VIN. VTEMP. IMON. GATE CS. CLREF SS. GND. Figure 2. Typical Application Main System Input Main Efuse Power Voltage Main System Main Efuse E fuse E fuse Control/.

4 Control/. Monitor Monitor PMBSUS Control and Monitor mController E fuse IMON Standby System Standby Power System Standby Efuse E fuse Control/. Monitor Figure 3. Typical Application Diagram 3. NCP81295 , NCP81296. System VIN. VIN VINF. mController FAULT IN GOK VDD. OVERCURRENT IN D_OC NCP81295 fuse protected ENABLE OUT ON System VIN. VOUT. GATE. TEMP MONITOR A/D IN VTEMP. CURRENT MONITOR A/D IN IMON SS. CURRENT LIMIT D/A OUT CLREF CS. GND. VIN VINF. GOK VDD. D_OC NCP81295 . ON. VOUT. GATE. VTEMP. IMON SS. CLREF CS. GND. VIN VINF. GOK VDD. D_OC NCP81295 . ON. VOUT. GATE. VTEMP. IMON SS. CLREF CS. GND. Figure 4. Application Schematic Parallel fuse Operation with Controller 4. NCP81295 , NCP81296. System VIN. mController VIN VINF. FAULT IN GOK VDD. OVERCURRENT IN D_OC GATE. ENABLE OUT ON NCP81295 /6. fuse Protected TEMP MONITOR A/D IN VTEMP VOUT System VIN. CURRENT LIMIT D/A OUT CLREF CS. CURRENT MONITOR A/D IN IMON SS.

5 GND. Figure 5. Application Schematic Single EFuse with Controller System VIN. VIN VINF. GOK VDD. D_OC GATE. ON NCP81295 /6. VTEMP VOUT fuse Protected System VIN. CLREF CS. IMON SS. GND. Figure 6. Application Schematic Stand alone Single EFuse 5. NCP81295 , NCP81296. System VIN. VIN VINF. GOK VDD. D_OC NCP81295 fuse protected ON System VIN. VOUT. GATE. VTEMP. IMON SS. CLREF CS. GND. VIN VINF. GOK VDD. D_OC NCP81295 . ON. VOUT. GATE. VTEMP. IMON SS. CLREF CS. GND. VIN VINF. GOK VDD. D_OC NCP81295 . ON. VOUT. GATE. VTEMP. IMON SS. CLREF CS. GND. Figure 7. Application Schematic Stand alone Parallel EFuse 6. NCP81295 , NCP81296. VIN 9 16 VOUT > 90 % VIN. SENSEFET VOUT > 80 % VIN. 1:5000 OUTPUT. MONITOR VOUT > 70 % VIN. VOUT > 40 % VIN. VINF 7 CHARGE. 5V PUMP. LDO VINF+2 XVDD. VDD 21 -32 VOUT. 25 32. 500. EN. VDD. VDD_UVR PD. 5 mA. 19 SS. ISC. A IMON 22 IMON. VDD. VOUT>90%VIN A CS 23 CS. 5mA. VOUT>70%VIN VDD. DRAIN MON.

6 GATE MON. ON 4. 10 mA. OVERCURRENT. 24 CLREF. VSWON TIMER. 3 D_OC. VCL_MAX. VSWOFF. LOGIC VCL_HI. VDD VCL_LO. DIE TEMP. MONITOR. VOC_TH(85% CLREF). VOUT>80%VIN. VOUT>40%VIN. VTEMP 18 5 GOK. 50 mA. GND 20. Figure 8. Block Diagram 7. NCP81295 , NCP81296. Table 2. PIN DESCRIPTION. Pin No. Symbol Description 1 NC4 No electrical connection internally. May connect to any potential 2 NC5 No electrical connection internally. May connect to any potential 3 D_OC Overcurrent indicator output (open drain). Low indicates the NCP81295 is limiting current. The D_OC. output does not report current limiting during soft start. 4 ON Enable input and output pulldown resistance control. 5 GOK OK status indicator output (open drain). Low indicates that the NCP81295 was turned off by a fault. 6 NC1 Test pin. Do not connect to this pin. Leave floating 7 VINF Control circuit power supply input. Connect to VIN pins through an RC filter.

7 (1 W / mF). 8 NC2 Internal FET sense pin. Do not connect to this pin. Leave floating 9 VIN09 Input of high current output switch 10 VIN10 Input of high current output switch 11 VIN11 Input of high current output switch 12 VIN12 Input of high current output switch 13 VIN13 Input of high current output switch 14 VIN14 Input of high current output switch 15 VIN15 Input of high current output switch 16 VIN16 Input of high current output switch 17 GATE Internal FET gate pin. Connect to the cathode of an anode grounded diode such as BAS16P2T5G. A. nF ceramic capacitor is reserved between this pin and GND for NCP81295 to mitigate the oscilla- tion risk when small amount of output capacitance (< 100 mF) or long input/output cable (large LIN /. LOUT) happens. 18 VTEMP Analog temperature monitor output. 19 SS Soft Start time programming pin. Connect a capacitor to this pin to set the softstart time. 20 GND Ground 21 VDD Linear regulator output 22 IMON Analog current monitor output 23 CS Current sense feedback output (current).

8 Scaling the voltage developed at this pin with a resistor to ground makes this also an input for several current limiting functions and overcurrent indicator D_OC. 24 CLREF Current limit setpoint input for normal operation (after soft start). 25 VOUT25 Output of high current output switch 26 VOUT26 Output of high current output switch 27 VOUT27 Output of high current output switch 28 VOUT28 Output of high current output switch 29 VOUT29 Output of high current output switch 30 VOUT30 Output of high current output switch 31 VOUT31 Output of high current output switch 32 VOUT32 Output of high current output switch 33 VIN33 Input of high current output switch 8. NCP81295 , NCP81296. Table 3. MAXIMUM RATINGS. Rating Symbol Min Max Unit Pin Voltage Range (Note 1) Vout enabled VINx, VINF 20 V. Pin Voltage Range (Note 1) Vout disabled (Note 2) VINx, VINF 30 V. Pin Voltage Range (Note 1) VOUTx 20 V. 1(<500 ms).

9 Pin Voltage Range (Note 1) VDD V. Pin Voltage Range (Note 3) All Other Pins VDD + V. Operating Junction Temperature TJ(max) 150 C. Storage Temperature Range TSTG 55 150 C. Lead Temperature Soldering TSLD 260 C. Reflow (SMD Styles Only), Pb Free Versions (Note 4). Electrostatic Discharge Charged Device Model ESDCDM kV. Electrostatic Discharge Human Body Model ESDHBM kV. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. All signals referenced to GND unless noted otherwise. 2. Vout disable is the state of output OFF when internal FET has turned off by disable ON or FAULTs protection. 3. Pin ratings referenced to VDD apply with VDD at any voltage within the VDD Pin Voltage Range. 4. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

10 Table 4. THERMAL CHARACTERISTICS. Rating Symbol Value Unit Thermal Resistance, Junction to Ambient (Note 5) R JA 30 C/W. Thermal Resistance, Junction to Top Case R JCT 50 C/W. Thermal Resistance, Junction to Bottom Case R JCB C/W. Thermal Resistance, Junction to Board (Note 6) R JB C/W. Thermal Resistance, Junction to Case (Note 7) R JC C/W. 5. RqJA is obtained by simulating the device mounted on a 500 mm2, 1 oz Cu pad on a 80 mm x 80 mm, mm thick 8 layer FR4 board. 6. RqJB value based on hottest board temperature within 1 mm of the package. 7. RqJC RqJCT // RqJCB (Two Resistor Compact Thermal Model, JESD15 3). Table 5. RECOMMENDED OPERATING RANGES. Parameter Symbol Min Max Unit VIN, VINF Pin Voltage Range 18 V. Maximum Continuous Output Current IAVE 50 A. Peak Output Current IPEAK 60 A. VDD Output Load Capacitance Range CVDD 10 mF. VTEMP Output Load Capacitance Range CVTEMP mF. Softstart Duration TSS 10 100 ms CS Load Resistance Range RCS 4 kW.


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