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MBR1H100SF - Schottky Power Rectifier

Semiconductor Components Industries, LLC, 2014 August, 2014 Rev. 21 Publication Order Number: MBR1H100SF /DMBR1H100 SFT3G,NRVB1H100 SFT3 GSurface MountSchottky Power RectifierPlastic SOD 123FL PackageThis device uses the Schottky Barrier principle with a large areametal to silicon Power diode . Ideally suited for low voltage, highfrequency rectification or as free wheeling and polarity protectiondiodes in surface mount applications where compact size and weightare critical to the system. Because of its small size, it is ideal for use inportable and battery powered products such as cellular and cordlessphones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC DC and DC DC converters,reverse battery protection, and Oring of multiple supply voltagesand any other application where performance and size are Guardring for Stress Protection Low Forward Voltage 175 C Operating Junction Temperature Epoxy Meets UL 94 V 0 Package Designed for Optimal Automated Board Assembly ESD Ratings: Machine Model, CHuman Body Model, 3B NRVB Prefix for Automotive and Other Applications RequiringUnique Site and Control Change Requirements; AEC Q101 Qualified a

Title: MBR1H100SF - Schottky Power Rectifier Author: s2190c Subject: This device uses the Schottky Barrier principle with a large area metal to silicon power diode.

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  Power, Diode, Rectifier, Schottky, Schottky power rectifier

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Transcription of MBR1H100SF - Schottky Power Rectifier

1 Semiconductor Components Industries, LLC, 2014 August, 2014 Rev. 21 Publication Order Number: MBR1H100SF /DMBR1H100 SFT3G,NRVB1H100 SFT3 GSurface MountSchottky Power RectifierPlastic SOD 123FL PackageThis device uses the Schottky Barrier principle with a large areametal to silicon Power diode . Ideally suited for low voltage, highfrequency rectification or as free wheeling and polarity protectiondiodes in surface mount applications where compact size and weightare critical to the system. Because of its small size, it is ideal for use inportable and battery powered products such as cellular and cordlessphones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC DC and DC DC converters,reverse battery protection, and Oring of multiple supply voltagesand any other application where performance and size are Guardring for Stress Protection Low Forward Voltage 175 C Operating Junction Temperature Epoxy Meets UL 94 V 0 Package Designed for Optimal Automated Board Assembly ESD Ratings: Machine Model, CHuman Body Model, 3B NRVB Prefix for Automotive and Other Applications RequiringUnique Site and Control Change Requirements.

2 AEC Q101 Qualified and PPAP Capable These Devices are Pb Free, Halogen Free/BFR Free and are RoHSCompliantMechanical Characteristics Reel Options: MBR1H100 SFT3G = 10,000 per 13 in reel/8 mm tape Device Marking: L1H Polarity Designator: Cathode Band Weight: mg (approximately) Case: Epoxy, Molded Lead Finish: 100% Matte Sn (Tin) Lead and Mounting Surface Temperature for Soldering Purposes:260 C Max. for 10 Seconds Device Meets MSL 1 RequirementsMARKING DIAGRAML1H= Specific Device CodeM= Date CodeG= Pb Free 123 FLCASE 498 Schottky AMPERES100 VOLTSD evicePackageShipping ORDERING INFORMATION For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationBrochure, BRD8011 123(Pb Free)10000/Tape & ReelL1 HMGGNRVB1H100 SFT3 GSOD 123(Pb Free)10000/Tape & Reel(Note.)

3 Microdot may be in either location)MBR1H100 SFT3G, NRVB1H100 SFT3 RATINGSR atingSymbolValueUnitPeak Repetitive Reverse VoltageWorking Peak Reverse VoltageDC Blocking VoltageVRRMVRWMVR100 VAverage Rectified Forward Current(TL = 162 C) Repetitive Peak Surge Current(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)IFSM50 AStorage and Operating Junction Temperature Range (Note 1)Tstg, TJ 65 to +175 CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be The heat generated must be less than the thermal conductivity fromJunction to Ambient: dPD/dTJ < 1 CHARACTERISTICSC haracteristicSymbolValueUnitThermal Resistance, Junction to Lead (Note 2)YJCL23 C/WThermal Resistance, Junction to Ambient (Note 2)RqJA85 C/WThermal Resistance, Junction to Ambient (Note 3)RqJA330 C/WELECTRICAL CHARACTERISTICSC haracteristicSymbolValueUnitMaximum Instantaneous Forward Voltage (Note 4)(IF = A, TJ = 25 C)(IF = A, TJ = 25 C)(IF = A, TJ = 125 C)(IF = A, TJ = 125 C) Instantaneous Reverse Current (Note 4)(Rated dc Voltage, TJ = 25 C)(Rated dc Voltage, TJ = 125 C) parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.

4 Productperformance may not be indicated by the Electrical Characteristics if operated under different Mounted with 700 mm2 copper pad size (Approximately 1 in2) 1 oz FR4 Mounted with pad size approximately 20 mm2 copper, 1 oz FR4 Pulse Test: Pulse Width 380 ms, Duty Cycle , NRVB1H100 SFT3 CHARACTERISTICSF igure 1. Typical Forward VoltageFigure 2. Maximum Forward VoltageVF, INSTANTANEOUS FORWARD VOLTAGE (V)VF, INSTANTANEOUS FORWARD VOLTAGE (V) 3. Typical Reverse CurrentFigure 4. Maximum Reverse CurrentVR, REVERSE VOLTAGE (V)VR, REVERSE VOLTAGE (V) , FORWARD CURRENT (A)IF, FORWARD CURRENT (A)IR, REVERSE CURRENT (mA)IR, REVERSE CURRENT (mA) C125 C25 C4070100150 C125 C25 C4070100 Figure 5. Current DeratingTL, LEAD TEMPERATURE ( C) (AV), AVERAGE FORWARD CURRENT (A)dcSquare Wave155170160 RqJL = 23 C/WIO, AVERAGE FORWARD CURRENT (A) , AVERAGE Power DISSIPATION (W)TJ = 175 CdcSquare WaveFigure 6.

5 Forward Power C125 C25 C125 C25 , NRVB1H100 SFT3 CHARACTERISTICSF igure 7. CapacitanceVR, REVERSE VOLTAGE (V)807060503020100020406080120C, CAPACITANCE (pF)4090100100140TJ = 25 TIME (s) (DUTY CYCLE)25%10% PULSE1000R(t) (C/W) TIME (s) (DUTY CYCLE)25%10% PULSE1000R(t) (C/W)Figure 8. Thermal Response, Junction to Ambient (20 mm2 pad) 9. Thermal Response, Junction to Ambient (1 in2 pad)MBR1H100 SFT3G, NRVB1H100 SFT3 DIMENSIONSSOD 123 FLCASE 498 ISSUE DNOTES:1. DIMENSIONING AND TOLERANCING PER ANSI , CONTROLLING DIMENSION: DIMENSIONS A AND B DO NOT INCLUDE MOLD DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTIONOF THE LEAD: BETWEEN AND MM FROM THE LEAD INDICATOROPTIONAL AS NEEDED *For additional information on our Pb Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, FOOTPRINT* 0 8 0 8 qqqTOP VIEWBOTTOM VIEWSIDE VIEWHE2X2 XEND VIEWRECOMMENDEDDIMENSIONS: ORDERING INFORMATIONN.

6 American Technical Support: 800 282 9855 Toll FreeUSA/CanadaEurope, Middle East and Africa Technical Support:Phone: 421 33 790 2910 Japan Customer Focus CenterPhone: 81 3 5817 1050 MBR1H100SF /DLITERATURE FULFILLMENT:Literature Distribution Center for ON Box 5163, Denver, Colorado 80217 USAP hone: 303 675 2175 or 800 344 3860 Toll Free USA/CanadaFax: 303 675 2176 or 800 344 3867 Toll Free USA/CanadaEmail: Semiconductor Website: Literature: additional information, please contact your localSales RepresentativeON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessedat SCILLC reserves the right to make changes without further notice to any products herein.

7 SCILLC makes no warranty, representationor guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheetsand/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for eachcustomer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whichthe failure of the SCILLC product could create a situation where personal injury or death may occur.

8 Should Buyer purchase or use SCILLC products for any such unintended orunauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, andexpenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claimalleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicablecopyright laws and is not for resale in any manner.


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