MBRD320 - Switch-mode Power Rectifiers

1 Semiconductor Components Industries, LLC, 2016 June, 2017 Rev. 101 Publication Order Number: MBRD320 /DMBRD320G, MBRD330G,MBRD340G, MBRD350G,MBRD360 GSwitch-modePower RectifiersDPAK Surface Mount PackageThese state of the art devices are designed for use as outputrectifiers, free wheeling, protection and steering diodes in switchingpower supplies, inverters and other inductive switching Extremely Fast Switching Extremely Low Forward Drop Platinum Barrier with Avalanche Guardrings NRVBD and SBRD Prefixes for Automotive and Other ApplicationsRequiring Unique Site and Control Change Requirements.

2 AEC Q101 Qualified and PPAP Capable These Devices are Pb Free, Halogen Free/BFR Free and are RoHSCompliantMechanical Characteristics: Case: Epoxy, Molded Weight: Gram (Approximately) Finish: All External Surfaces Corrosion Resistant and TerminalLeads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes;260 C Max. for 10 Seconds ESD Ratings: Machine Model = C Human Body Model = 3 BSCHOTTKY AMPERES, 20 60 detailed ordering and shipping information in the packagedimensions section on page 3 of this data INFORMATIONA= Assembly Location*Y= YearWW= Work WeekB3x0= Device Codex= 2, 3, 4, 5, or 6G= Pb Free PackageDPAKCASE 369 CMARKING DIAGRAMAYWWB3x0G* The Assembly Location Code (A) is front sideoptional.

3 In cases where the Assembly Location isstamped in the package bottom (molding ejecterpin), the front side assembly code may be , MBRD330G, MBRD340G, MBRD350G, RATINGSR atingSymbolMBRD/SBRD8 Unit320330340350360 Peak Repetitive Reverse VoltageWorking Peak Reverse VoltageDC Blocking VoltageVRRMVRWMVR2030405060 VAverage Rectified Forward Current (TC = +125 C, Rated VR)IF(AV)3 APeak Repetitive Forward Current, TC = +125 C(Rated VR, Square Wave, 20 kHz)IFRM6 ANonrepetitive Peak Surge Current(Surge applied at rated load conditions halfwave, single phase, 60 Hz)IFSM75 APeak Repetitive Reverse Surge Current (2 ms, 1 kHz)IRRM1 AOperating Junction Temperature Range (Note 1)TJ 65 to +175 CStorage Temperature RangeTstg 65 to +175 CVoltage Rate of Change (Rated VR)dv/dt10,000V/msStresses exceeding those listed in the Maximum Ratings table may damage the device.

4 If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be The heat generated must be less than the thermal conductivity from Junction to Ambient: dPD/dTJ < 1 CHARACTERISTICSC haracteristicSymbolValueUnitMaximum Thermal Resistance, Junction to CaseRqJC6 C/WMaximum Thermal Resistance, Junction to Ambient (Note 2)RqJA80 C/W2. Rating applies when surface mounted on the minimum pad size CHARACTERISTICSC haracteristicSymbolValueUnitMaximum Instantaneous Forward Voltage (Note 3)iF = 3 Amps, TC = +25 CiF = 3 Amps, TC = +125 CiF = 6 Amps, TC = +25 CiF = 6 Amps, TC = +125 Instantaneous Reverse Current (Note 3)(Rated dc Voltage, TC = +25 C)(Rated dc Voltage, TC = +125 C) parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.

5 Productperformance may not be indicated by the Electrical Characteristics if operated under different Pulse Test: Pulse Width = 300 ms, Duty Cycle , MBRD330G, MBRD340G, MBRD350G, INFORMATIOND evicePackageShipping MBRD320 GDPAK(Pb Free)75 Units / RailSBRD8320G*75 Units / RailSBRD8320G VF01*75 Units / RailMBRD320 RLG1,800 Tape & ReelMBRD320T4G2,500 Tape & ReelSBRD8320T4G*2,500 Tape & ReelSBRD8320T4G VF01*2,500 Tape & ReelMBRD330G75 Units / RailSBRD8330G*75 Units / RailSBRD8330G VF01*75 Units / RailMBRD330 RLG1,800 Tape & ReelMBRD330T4G2,500 Tape & ReelSBRD8330T4G*2,500 Tape & ReelSBRD8330T4G VF01*2,500 Tape & ReelMBRD340G75 Units / RailSBRD8340G*75 Units / RailSBRD8340G VF01*75 Units / RailMBRD340 RLG1,800 Tape & ReelMBRD340T4G2.

6 500 Tape & ReelSBRD8340T4G*2,500 Tape & ReelSBRD8340T4G VF01*2,500 Tape & ReelMBRD350G75 Units / RailSBRD8350G*75 Units / RailSBRD8350G VF01*75 Units / RailMBRD350 RLG1,800 Tape & ReelSBRD8350 RLG*1,800 Tape & ReelSBRD8350 RLG VF01*1,800 Tape & ReelMBRD350T4G2,500 Tape & ReelSBRD8350T4G*2,500 Tape & ReelSBRD8350T4G VF01*2,500 Tape & ReelMBRD360G75 Units / RailSBRD8360G*75 Units / RailSBRD8360G VF01*75 Units / RailMBRD360 RLG1,800 Tape & ReelSBRD8360 RLG*1,800 Tape & ReelSBRD8360 RLG VF01*1,800 Tape & ReelMBRD360T4G2,500 Tape & ReelNRVBD360VT4G*2,500 Tape & ReelSBRD8360T4G*2,500 Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

7 *NRVBD and SBRD Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q101 Qualified and PPAP , MBRD330G, MBRD340G, MBRD350G, CHARACTERISTICSF igure 1. Typical Forward VoltageFigure 2. Typical Reverse CurrentFigure 3. Average Power , INSTANTANEOUS VOLTAGE (VOLTS)10010VR, REVERSE VOLTAGE (VOLTS) (AV), AVERAGE FORWARD CURRENT (AMPS) , INSTANTANEOUS FORWARD CURRENT (AMPS)IPF(AV), AVERAGE Power DISSIPATION (WATTS) , REVERSE CURRENT (mA) = 25 C150 C125 C75 CTJ = 150 CIPK/IAV = 20 SINEWAVESQUAREWAVEdc105TJ = 150 C*The curves shown are typical for the highest voltage device in thevoltage grouping.

8 Typical reverse current for lower voltage selectionscan be estimated from these curves if VR is sufficient below rated C75 C25 CMBRD320G, MBRD330G, MBRD340G, MBRD350G, CHARACTERISTICSF igure 4. Current Derating, CaseFigure 5. Current Derating, AmbientFigure 6. Typical Capacitance14080TC, CASE TEMPERATURE ( C) , AMBIENT TEMPERATURE ( C) , REVERSE VOLTAGE (VOLTS)100705030201070IF(AV), AVERAGE FORWARD CURRENT (AMPS)C, CAPACITANCE (pF) (AV), AVERAGE FORWARD CURRENT (AMPS)2003005007001 KTJ = 25 CRATED VOLTAGE APPLIEDTJ = 150 CRqJC = 6 C/WdcSINEWAVEORSQUAREWAVETJ = 150 CTJ = 150 CTJ = 125 CRqJA = 80 C/WSURFACE MOUNTED ON SIZE RECOMMENDEDSQUARE WAVEORSINE WAVEVR = 25 VdcMBRD320G, MBRD330G, MBRD340G, MBRD350G, DIMENSIONSDPAK (SINGLE GAUGE)CASE 369 CISSUE mminches SCALE 3.

9 1*For additional information on our Pb Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, FOOTPRINT* ( ) NOTES:1. DIMENSIONING AND TOLERANCING PER , CONTROLLING DIMENSION: THERMAL PAD CONTOUR OPTIONAL WITHIN DI-MENSIONS b3, L3 and DIMENSIONS D AND E DO NOT INCLUDE MOLDFLASH, PROTRUSIONS, OR BURRS. MOLDFLASH, PROTRUSIONS, OR GATE BURRS SHALLNOT EXCEED INCHES PER DIMENSIONS D AND E ARE DETERMINED AT THEOUTERMOST EXTREMES OF THE PLASTIC DATUMS A AND B ARE DETERMINED AT DATUMPLANE OPTIONAL MOLD BSCA1 HDETAIL ASEATINGPLANEABCL1 LHL2 GAUGEPLANEDETAIL AROTATED 90 CW5eBOTTOM VIEWZBOTTOM VIEWSIDE VIEWTOP VIEWALTERNATECONSTRUCTIONSNOTE 7 ZON Semiconductor and are trademarks of Semiconductor Components Industries.

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