Transcription of NCP1032 - Low Power PWM Controller with On …
1 Semiconductor Components Industries, LLC, 2014 August, 2019 Rev. 31 Publication Order Number: NCP1032 /DNCP1032 Low Power PWM Controllerwith On-Chip Power SwitchThe NCP1032 is a miniature high voltage monolithic switchingconverter with on chip Power switch and startup circuits. Itincorporates in a single IC all the active Power control logic andprotection circuitry required to implement, with minimal externalcomponents several switching regulator applications, such as asecondary side bias supply or a low Power DC DC converter. Thisconverter is ideally suited for 24 V and 48 V telecom and medicalisolated Power supply applications. The NCP1032 can be configuredin any single ended topology such as forward or flyback NCP1032 is targeted for applications requiring up to 3 internal error amplifier allows the NCP1032 to be easilyconfigured for secondary or primary side regulation operation inisolated and non isolated configurations.
2 The fixed frequencyoscillator is optimized for operation up to 1 MHz and is capable ofexternal frequency synchronization, providing additional designflexibility. In addition, the NCP1032 incorporates undervoltage andovervoltage line detectors, programmable cycle by cycle currentlimit, internal soft start, and thermal shutdown to protect thecontroller under fault On Chip High 200 V Power Switch Circuit and Startup Circuit Internal Startup Regulator with Auxiliary Winding Override Programmable Oscillator Frequency Operation up to 1 MHz External Frequency Synchronization Capability Frequency Fold down Under Fault Conditions Trimmed 2% Internal Reference Programmable Cycle by Cycle Current Limit Internal Soft Start Active Leading Edge Blanking Circuit Line Under and Over Voltage Protection Over Temperature Protection These are Pb Free DevicesTypical Applications POE ( Power Over Ethernet)/PD.
3 Refer to Application Note AND8247 Secondary Side Bias Supply for Isolated DC DC Converters Stand Alone Low Power DC DC Converter Low Power Bias Supply Low Power Boost Converter Medical Isolated Power Supplies Bias Supply for Telecom Systems. Refer to App Note AND8119 = Specific Device Markingx = A or BA = Assembly LocationL = Wafer LotY = YearW = Work WeekG= Pb Free PackagePIN CONNECTIONS(Note: Microdot may be in either location)See detailed ordering and shipping information in the packagedimensions section on page 20 of this data INFORMATIONWDFN8MN SUFFIXCASE 511BH1032xALYW GG WDFN8 (Top View) 1. Typical Application Dual Output Auxiliary Regulated Isolated FlybackD1D2 COUTCVCCCinR3R4 RCLCCTCCRCCPR1R2 NCP 1032 mF22 mFFigure 2. NCP1032 Simplified Block VSRPWMCOMPNCLNSS 30 ns One Shot + VErrorAmplifier + + V + + VI2 VFaultLogicNUVLONLOWVCCHIVCCNUVLONLOWVCC HIVCCIN1IN2IN3IN4 UVBARUVBARNUVOUT2 NUVNOVNOVIN5IN6nstartFaultFaultFaultLEBO UTLEBOUTC urrentLimitSSIN7 Thermal mAPGNDVDRAINOUT3 DriverRTUVBARI nternal BiasnstartVCCI nternal BiasInternal Bias(all pins except VDRAIN pin are protected by 10 V ESD diodes)Cycle= 75%Delay2 kW2 V2 kW2 kW2 V150 kW2 1.
4 FUNCTIONAL PIN DESCRIPTIONPinNameFunctionDescription1 GNDIC GroundGround reference pin for the FrequencySelectionAn external capacitor connected to this pin sets the oscillator frequency up to 1 MHz. Theoscillator can be synchronized to a higher frequency by charging or discharging CT to trip theinternal V comparators. If a fault condition exists, the Power switch is disabled andthe frequency is Signal InputThe regulated voltage is scaled down to V by means of a resistor divider. Regulation isachieved by comparing the scaled voltage to an internal V AmplifierCompensationThe output of the internal error amplifier. External compensation network between COMPand VFB pin is required for stable Limit ThresholdSelectionA resistor RCL connected between this pin and ground sets the peak current value of thecurrent limit. If the CL pin is left open, the current limit value is set to its initial maximum valueof approximately 12 mA (CLIM_MAX).
5 Programmable current limit threshold, together withinternal soft start feature effectively limits the primary transformer high current peaks duringstartup Line Undervoltageand OvervoltageShutdownInput line voltage is scaled down using an external resistor divider. The minimum operatingVin voltage is achieved when the voltage on UV/OV pin reaches UV threshold V. Themaximum operating voltage is then limited by V on UV/OV pin. A device version withoutOV protection feature is available, see ordering information the InternalCircuitrySupplies Power to the internal control circuitry. Connect an external capacitor for energystorage during startup. The Vcc voltage should not exceed 16 V during ConnectionConnects the Power switch and startup circuit to the primary transformer FlagThis is the thermal flag for the IC and should be soldered to the ground 2. MAXIMUM RATINGSR atingSymbolValueUnitPower Switch and Startup Circuits VoltageBVdss to +200 VVCC Power Supply VoltageVCC to +16 VPower Supply Voltage on all Pins, except VDRAIN and VCCVIO to +10 VDrain Current Peak During Transformer SaturationIDS(pk) Resistance Junction to Air W DFN8 3x3, case 511BH(100 sq mm, 2oz) (Note 4)(500 sq mm, 2oz) (Note 4)(100 sq mm,2oz,) (Note 5)RqJA1096444 C/WMaximum Junction TemperatureTJMAX150 CStorage Temperature RangeTSTG 60 to +150 CESD Capability, Human Body Model Pins 1 7 (Note 1) Capability, Machine Model Pins 1 7 (Note 1)400 VPin 8 is connected to the high voltage startup and Power switch which is protected tothe maximum drain voltage200 VStresses exceeding those listed in the Maximum Ratings table may damage the device.
6 If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be This device series contains ESD protection and passes the following tests:Human Body Model (HBM) kV per JEDEC standard: JESD22 Model (MM) 200 V per JEDEC standard: JESD22 This device contains latch up protection and it exceeds 100 mA per JEDEC standard: JESD78 class II3. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J STD 020A4. EIA JEDEC , single layer PCB with added heat spreader5. EIA JEDEC , four layer PCB with added heat 3. ELECTRICAL CHARACTERISTICS (For typical values Tj = 25 C, for min/max values Tj = 40 C to +125 C, VDRAIN = 48 V, VCC = 12 V, unless otherwise noted)SymbolParameterConditionsMinTypMax UnitSUPPLY SECTION AND VCC MANAGEMENTVCC_ONVcc Voltage at Which the SwitcherStarts OperationVCC Operating VCC After Turn onat Which HV Current Source RestartsVCC Undervoltage Lockout VoltageVCC Decreasing, VFB = IC Consumption Power Switch EnabledMOSFET is switching at 300 IC ConsumptionPower Switch DisabledNo Fault condition, VFB = V IC ConsumptionPower Switch DisabledFault condition,VFB = V, VUV/OV < V SWITCH CIRCUITRDSONP ower Switch Circuit On StateResistanceID = 100 mATJ = 25 CTJ = 125 C Switch Circuit and StartupBreakdown VoltageIDS_OFF = 100 mA, VUV_OV < VTj = 25 C200 VIDS_OFFP ower Switch Circuit and StartupCircuit Off State Leakage CurrentVDRAIN = 200 V, VUV_OV < VTJ = 25 CTJ = 40 C to 125 C 20202530mAtRSwitching Characteristics Rise TimeVDS = 48 V, RL = 480 W, Time(10% 90%)
7 7 nstfSwitching Characteristics Fall TimeVDS = 48 V, RL = 480 W, Time(90% 10%) 10 nsINTERNAL STARTUP CURRENT SOURCEISTART1HV Current SourceVcc = 0 V,Tj = 25 CTj = 40 C to 125 Current SourceVcc = VCC_ON VTj = 25 CTj = 40 C to 125 Startup VoltageISTART2 = mA, Vcc = VCC_ON V, Tj = 25 C VERROR AMPLIFIERVREFR eference VoltageVCOMP = VFB, Follower ModeTJ = 25 CTJ = 40 C to 125 RegulationVCC = 8 V to 16 V, TJ = 25 C Bias CurrentVFB = V 70150nAISRCCOMP Source CurrentVFB = V8095125mAISNKCOMP Sink CurrentVFB = V500700900mAVC_MAXCOMP Maximum VoltageISRC = 0 mA, VFB = Minimum VoltageISNK = 0 mA, VFB = V 91200mVAVOLOpen Loop Voltage Gain(Note 6) 80 dBGBWGain Bandwidth Product(Note 6) 3. ELECTRICAL CHARACTERISTICS (For typical values Tj = 25 C, for min/max values Tj = 40 C to +125 C, VDRAIN = 48 V, VCC = 12 V, unless otherwise noted)SymbolUnitMaxTypMinConditionsParam eterCURRENT LIMIT AND PWM COMPARATORCLIM_MAXMax Current Limit ThresholdCL pin Floating, TJ = 25 C,(di/dt = A/ms)420512600mACLIM_MINMin Current Limit ThresholdRCL = 20 kW, TJ = 25 C, (di/dt = A/ms) 57 mATPLHP ropagation Delayfrom Current Limit Detection to theDrain OFF State (Note 6) 100 nsTON_MINMin On Time Pulse WidthFSW = 300 kHz (Note 6) 240 nsTssSoft Start Duration(Note 6) msLINE UNDER/OVERVOLTAGE PROTECTIONSVuvUndervoltage Lockout ThresholdVFB = VCOMP, Vin Lockout Hysteresis 70 mVIuvInput Bias CurrentVFB = V 01mAVOVO vervoltage Lockout ThresholdVFB = VCOMP, Vin increasing (Note 7) Lockout Hysteresis 158 mVTEMPERATURE MANAGEMENTTSDT hermal Shutdown(Note 6)
8 165 CHysteresis in Shutdown(Note 6)20 CINTERNAL OSCILLATORfOSC1 Oscillation Frequency, 300 kHzCT = 560 pF (Note 8)TJ = 25 CTJ = 40 C to 125 C275270300 325335kHzfOSC2 Oscillation Frequency, 960 kHzCT = 100 pF, TJ = 25 C 960 kHzICT_CTiming Charge CurrentVCT = V 172 mAICT_DTiming Discharge CurrentVCT = V517mAVR_pkOscillator Ramp Peak Voltage VVR_VLYO scillator Ramp Valley VDCMAxMaximum Duty parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Productperformance may not be indicated by the Electrical Characteristics if operated under different Guaranteed by design and characterized7. The OV/UV option is disabled on the NCP1032B version8. Oscillator frequency can be externally synchronized to the maximum frequency of the OPERATING CHARACTERISTICS Dual Output Isolated Flyback ConverterFigure 3.
9 Efficiency vs. IOUT at VIN = 24, 36, 48and 72 V, T1 = CoilCraft B0226 ELFigure 4. VCC Pin Load Regulation at VIN = 24,36, 48 and 72 VIOUT (mA)IOUT (mA) 5. Startup Sequence, RCL Open, OutputLoad = 80 W (IOUT = 150 mA), 1 VCC V/div DC, 2 VOUT V/div DC, 3 VIN V/div DC, 4 IPRI 100 mA/div DC, T = 20 ms/divFigure 6. Soft Start, RCL open, Output NoLoad 1 VCC V/div DC, 2 VOUT V/div DC,3 VIN V/div DC, 4 IPRI 100 mA/div DC,T = 500 ms/divFigure 7. Soft Start, RCL = 32 kW (CLIM =250 mA), Output Load = 240 W (IOUT = 50 mA),1 VCC V/div DC, 2 VOUT V/div DC, 3 V/div DC, 4 IPRI 100 mA/div DC,T = ms/divFigure 8. Discontinuous Conduction Mode(DCM), IOUT = 150 mA, 2 VDRAIN 20 V/div DC, 3 ISEC 30 mA/div DC, 4 IPRI 100 mA/div, DC, T = 500 ns/divEFFICIENCY (%)VOUT (V)1252254036 V48 V72 V24 V18 V48 V72 V24 V18 OPERATING CHARACTERISTICSF igure 9. Frequency vs. Timing Capacitor CTat 255 CFigure 10.
10 Oscillator Frequency vs. JunctionTemperatureCAPACITANCE (pF)AMBIENT TEMPERATURE ( C)24802000152010405608050100200400800160 0100806040200 20 4030040050060080090010001100 Figure 11. Maximum Duty Ratio 12. Maximum Duty Ratio vs. VCCV oltageAMBIENT TEMPERATURE ( C)VCC (V)100806040200 20 13. Minimum On Time vs. VCCF igure 14. Power Switch Circuit and StartupCircuit Leakage Current vs. Drain VoltageVCC (V)DRAIN VOLTAGE (V)1514131211109810012016018022024028030 0240200160120804000481216202830 FREQUENCY (kHz)SWITCHING FREQUENCY (kHz)DUTY CYCLE (%)DUTY CYCLE (%)MIN ON TIME (ns)IDS(off), Power SWITCH AND STARTUPCIRCUITS LEAKAGE CURRENT (mA)120700CT = 82 pFCT = 220 pFCT = 560 MHz597 kHz320 kHz128 kHz16 VDRAIN = 100 VVDRAIN = 48 VVDRAIN = 15 V16140200260 VDRAIN = 100 VVDRAIN = 48 VVDRAIN = 15 V24610141822262125 C25 C 40 OPERATING CHARACTERISTICSF igure 15. Power Switch RDSON vs. JunctionTemperatureFigure 16.