NCV47722 - High Side Switch with Adjustable …

1 Semiconductor Components Industries, LLC, 2015 July, 2020 Rev. 11 Publication Order Number: NCV47722 /DHigh Side Switch withAdjustable current Limitand Diagnostic FeaturesNCV47722 The NCV47722 High Side Switch (HSS) with 250 mA is designedfor use in harsh automotive environments. The device has a high peakinput voltage tolerance and reverse input voltage, reverse bias,overcurrent and overtemperature protections. The integrated currentsense feature ( Adjustable by resistor connected to CSO pin) providesdiagnosis and system protection functionality. The CSO pin outputcurrent creates voltage drop across CSO resistor which is proportionalto output current . Extended diagnostic features in OFF state are alsoavailable and controlled by dedicated input and output Output current : up to 250 mA Enable Input ( V Logic Compatible) Adjustable current Limit: up to 350 mA Protection Features: current Limitation Thermal Shutdown Reverse Input Voltage and Reverse Bias Voltage Diagnostic Features: Short To Battery (STB) and Open Load (OL) in OFF State Internal Components for OFF State Diagnostics Open Collector Flag Output Output Voltage Monitoring Output (analog) AEC Q100 Grade 1 Qualified and PPAP Capable These Devices are Pb Free, Halogen Free/BFR Free and are RoHSCompliantTypical Applications Audio and Infotainment System Active Safety SystemFigure 1.

2 Application SchematicVoutGNDVinCSOENCinCoutRCSOCCSO1 F1 FNCV477221 FDEEFD iagnostic Enable InputError Flag Output (Open Collector)Vout_FBTo A/D*Vout_FB is sensed Vout output voltage via internal resistor dividerThis document contains information on some products that are still under Semiconductor reserves the right to change or discontinue these products INFORMATIONSee detailed ordering and shipping information in the packagedimensions section on page 10 of this data 14 Exposed PadCASE 948 AWNCV47722 ALYWGG11411447722= Specific Device CodeA= Assembly LocationL= Wafer LotY= YearW= Work WeekG= Pb Free Package(Note: Microdot may be in either location) 2. Simplified Block VVOLTAGEREFERENCETHERMALSHUTDOWNSATURATI ONPROTECTIONENCSOPASS DEVICEANDCURRENT MIRRORDEIPU_ONEFSTB_OL_OFFGND+ + + V780k780k10 mAIPU_ON*)for current value of RATIO see into Electrical Characteristic TableVREFVREF_OFFVinIPURPD_ONRPD_DEVoutV REFICSO = Iout / RATIO* 3.

3 Pin Connections (Top Views)NCTSSOP 14 EPADVoutVout_FBVinTable 1. PIN FUNCTION DESCRIPTIONPin 14 EPADPin NameDescription1 NCNot Connected, not internally Connected, not internally Connected, not internally Supply Input; low level disables regulator. (Used also for OFF state diagnostics Sense Output, current Limit setting and Output current value information. See Application Sectionfor more Supply Output Voltage Analog Monitoring. See Application Section for more Enable Flag (Open Collector) Output. Active Connected, not internally Connected, not internally Connected, not internally Pad is connected to Ground. Connect to GND plane on 2. MAXIMUM RATINGSR atingSymbolMinMaxUnitInput Voltage DCVin 4245 VInput Voltage (Note 1)Load Dump SuppressedUs* 60 VEnable Input VoltageVEN 4245 VOutput Voltage MonitoringVout_FB VoltageVCSO , CS and EF VoltagesVDE, VCS, VEF VoltageVout 140 VJunction TemperatureTJ 40150 CStorage TemperatureTSTG 55150 CStresses exceeding those listed in the Maximum Ratings table may damage the device.)

4 If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be Load Dump Test B ( with centralized load dump suppression) according to ISO16750 2 standard. Guaranteed by design. Not tested inproduction. Passed Class A according to ISO16750 3. ESD CAPABILITY (Note 2)RatingSymbolMinMaxUnitESD Capability, Human Body ModelESDHBM 22kV2. This device series incorporates ESD protection and is tested by the following methods:ESD Human Body Model tested per AEC Q100 002 (JS 001 2010)Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes < 50 mm2 dueto the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveformcharacteristic defined in JEDEC JS 002 4.

5 LEAD SOLDERING TEMPERATURE AND MSL (Note 3)RatingSymbolMinMaxUnitMoisture Sensitivity LevelMSL1 3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/DTHERMAL CHARACTERISTICS (Note 4)RatingSymbolValueUnitThermal Characteristics (single layer PCB)Thermal Resistance, Junction to Air (Note 5)Thermal Reference, Junction to Lead (Note 5)R JAR C/WThermal Characteristics (4 layers PCB)Thermal Resistance, Junction to Air (Note 5)Thermal Reference, Junction to Lead (Note 5)R JAR C/W4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer according to ,4 layers according to 5. RECOMMENDED OPERATING RANGESR atingSymbolMinMaxUnitInput Voltage (Note 6) current Limit (Note 7)ILIM10350mAJunction TemperatureTJ 40150 CCurrent Sense Output (CSO) operation above the stresses listed in the Recommended Operating Ranges is not implied.

6 Extended exposure to stresses beyondthe Recommended Operating Ranges limits may affect device Minimum Vin = V or (Vout + V), whichever is Corresponding RCSO is in range from kW down to 2185 6. ELECTRICAL CHARACTERISTICS Vin = V, VEN = V, RCSO = 0 W, CCSO = 1 mF, Cin = 1 mF, Cout = 1mF, Min andMax values are valid for temperature range 40 C v TJ v +150 C unless noted otherwise and are guaranteed by test, design orstatistical correlation. Typical values are referenced to TJ = 25 C (Note 8)ParameterTest ConditionsSymbolMinTypMaxUnitOUTPUTSI nput to Output Differential VoltageVin = 8 V to 18 VIout = 200 mAIout = 250 mAVin out 200225350400mVCURRENT LIMIT PROTECTIONC urrent LimitVout = Vin 1 VILIM350 mADISABLE AND QUIESCENT CURRENTSD isable CurrentVEN = 0 VIDIS current , Iq = Iin IoutIout = 500 mA, Vin = 8 V to 18 VIq current , Iq = Iin IoutIout = 200 mA, Vin = 8 V to 18 VIq 819mAQuiescent current , Iq = Iin IoutIout = 250 mA, Vin = 8 V to 18 VIq 1125mAENABLEE nable Input Threshold VoltageLogic Low (OFF)Logic High (ON)Vout v VVout w Vin 1 VVth(EN) Input CurrentVEN = VIEN2920mATurn On Timefrom Enable ON to Vout = Vin 1 VIout = 100 mAton 25 msOUTPUT current SENSECSO Voltage Level at current LimitVout = Vin 1 VRCSO = k ( 4%)

7 (+4%)VCSO Transient Voltage LevelCCSO = mF, RCSO = k Iout pulse from 10 mA to 350 mA, tr = 1 msVCSO current to CSO current RatioVCSO = 2 V, Iout = 10 mA to 50 mAVin = 8 V to 18 V, 40 C v TJ v +150 CIout/ICSO ( 15%)265 (+15%) Output current to CSO current RatioVCSO = 2 V, Iout = 50 mA to 350 mAVin = 8 V to 18 V, 40 C v TJ v +150 CIout/ICSO ( 5%)285 (+5%) CSO current at no Load CurrentVCSO = 0 V, Iout = 0 mAICSO_off 15mADIAGNOSTICSO vercurrent Voltage Level ThresholdVout = Vin 1 VRCSO = k VOC929598% ofVCSO_IlimShort To Battery (STB) Voltage Threshold in OFF stateVin = V to 18 V, Iout = 0 mAVSTB234 VOpen Load (OL) current Threshold inOFF stateVin = V to 18 VIOL51025mAOutput Voltage to Output Feedback Voltage RatioVin = V to 18 Diagnostics Enable Threshold VoltageLogic Low (OFF)Logic High (ON)Vth(DE) Flag Low VoltageIEF = 1 mAVEF_Low SHUTDOWNT hermal Shutdown Temperature (Note 9)Iout = 90 mATSD150175195 CProduct parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.

8 Productperformance may not be indicated by the Electrical Characteristics if operated under different Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [ TJ. Low dutycycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as Values based on design and/or CHARACTERISTICSF igure 4. Input to Output Differential Voltagevs. TemperatureFigure 5. Input to Output Differential Voltagevs. Output CurrentTJ, JUNCTION TEMPERATURE ( C)Iout, OUTPUT current (mA)1401008060400 20 4003503002502001501005000501001502003003 50400 Figure 6. Output current Limit vs. InputVoltageFigure 7. Input current vs. Input Voltage(Reverse Input Voltage)Vin, INPUT VOLTAGE (V)Vin, INPUT VOLTAGE (V)4035302015105050055060065070080085090 0 5 15 20 25 30 35 40 45 8.]

9 Output current Limit vs. RCSOF igure 9. CSO Voltage vs. Output current (% of ILIM)RCSO (kW)Iout, OUTPUT current (% of ILIM) out, INPUT TO OUTPUTDIFFERENTIAL VOLTAGE (mV)ILIM, OUTPUT current LIMIT (mA)Iin, INPUT current (mA)ILIM, OUTPUT current LIMIT (mA)VCSO, CSO VOLTAGE (V)Vout = (Vin 1 V) VTJ = 150 CTJ = 25 CTJ = 40 C2545750TJ = 25 CRout = kW 100TJ = 150 CTJ = 25 CTJ = 40 CVin = V40025020120160 Vin out, INPUT TO OUTPUTDIFFERENTIAL VOLTAGE (mV)50100150200300350400250 Vin = VIout = 350 mAIout = 200 mAIout = 15 mA802504060100 110TJ = 40 C to 150 CILIM = 10 mA to 350 CHARACTERISTICSF igure 10. Quiescent current vs. OutputCurrent (Low Load)Figure 11. Quiescent current vs. OutputCurrent (High Load)Iout, OUTPUT current (mA)Iout, OUTPUT current (mA) 12. Output current to CSO CurrentRatio vs. Output CurrentIout, OUTPUT current (mA)100010010250260270275290295300310Iq, QUIESCENT current (mA)Iq, QUIESCENT current (mA)Iout/ICSO, OUTPUT current TOCSO current RATIO ( )25526528028530541218TJ = 25 CVin = VTJ = 25 CVin = VTJ = 25 CVin = VDEFINITIONSG eneralAll measurements are performed using short pulse lowduty cycle techniques to maintain junction temperature asclose as possible to ambient to Output Differential VoltageThe Input to Output Differential Voltage parameter isdefined for specific output current values and specified overTemperature and Disable CurrentsQuiescent current (Iq) is the difference between the inputcurrent (measured through the LDO input pin) and theoutput load current .

10 If Enable pin is set to LOW the regulatorreduces its internal bias and shuts off the output, this term iscalled the disable current (IDIS). current LimitCurrent Limit is value of output current by which outputvoltage drops 1 V below input supply voltage ProtectionInternal thermal shutdown circuitry is provided to protectthe integrated circuit in the event that the maximum junctiontemperature is exceeded. When activated at typically 175 C,the regulator turns off. This feature is provided to preventfailures from accidental Package Power DissipationThe power dissipation level is maximum allowed powerdissipation for particular package or power dissipation atwhich the junction temperature reaches its maximumoperating value, whichever is INFORMATIONC ircuit DescriptionThe NCV47722 is an integrated High Side Switch (HSS) with output current capability up to 250 mA to output.