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NCV8664 - Low Dropout Linear Regulator

Semiconductor Components Industries, LLC, 2010 September, 2010 Rev. 181 Publication Order Number: NCV8664 /DNCV8664 Very Low Iq Low DropoutLinear RegulatorThe NCV8664 is a precision V and V fixed output, lowdropout integrated voltage Regulator with an output currentcapability of 150 mA. Careful management of light load currentconsumption, combined with a low leakage process, achieve atypical quiescent current of 22 is pin and functionally compatible with NCV4264 andNCV4264 2, and it could replace these parts when very lowquiescent current is output voltage is accurate within , and maximumdropout voltage is 600 mV at full rated load is internally protected against input supply reversal, outputovercurrent faults, and excess di

NCV8664 http://onsemi.com 3 LEAD SOLDERING TEMPERATURE AND MSL Rating Symbol Min Max Unit Lead Temperature Soldering Reflow …

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Transcription of NCV8664 - Low Dropout Linear Regulator

1 Semiconductor Components Industries, LLC, 2010 September, 2010 Rev. 181 Publication Order Number: NCV8664 /DNCV8664 Very Low Iq Low DropoutLinear RegulatorThe NCV8664 is a precision V and V fixed output, lowdropout integrated voltage Regulator with an output currentcapability of 150 mA. Careful management of light load currentconsumption, combined with a low leakage process, achieve atypical quiescent current of 22 is pin and functionally compatible with NCV4264 andNCV4264 2, and it could replace these parts when very lowquiescent current is output voltage is accurate within , and maximumdropout voltage is 600 mV at full rated load is internally protected against input supply reversal, outputovercurrent faults, and excess die temperature.

2 No externalcomponents are required to enable these V, V Fixed Output Output Accuracy, Over Full Temperature Range 30 A Maximum Quiescent Current at IOUT = 100 A 600 mV Maximum Dropout Voltage at 150 mA Load Current Wide Input Voltage Operating Range of V to 45 V Internal Fault Protection 42 V Reverse Voltage Short Circuit/Overcurrent Thermal Overload NCV Prefix for Automotive and Other Applications Requiring Siteand Control Changes AEC Q100 Qualified EMC Compliant These are Pb Free DevicesSOT 223ST SUFFIXCASE 318 EPIN Voltage Rating DPAK(50 = V Version)(33 = V Version)x= Voltage Rating SOT223(5 = V Version)

3 (3 = V Version)A= Assembly LocationL= Wafer LotY= YearW, WW = Work WeekG or G= Pb Free PackageSee detailed ordering and shipping information in the packagedimensions section on page 11 of this data INFORMATION123 TAB1234V664xxGALYWWDPAKDT SUFFIXCASE 369C(SOT 223/DPAK)PINFUNCTION1 VIN2,TAB GND3 VOUT11 AYWV664xGG(Note: Microdot may be in either location)18 SOIC 8 FusedCASE 751V664xALYWX G18(SOIC 8 Fused)PINFUNCTION1NC2, VReference+-ErrorAmpThermalShutdownOUTGN DF igure 1. Block DiagramPIN FUNCTION DESCRIPTIONPin 223 SOIC 812 VINU nregulated input voltage; V to 45 ; output voltage; collector of the internal PNP pass GNDG round; substrate and best thermal connection to the die.

4 1, 5 8 NCNo RANGEPin Symbol, ParameterSymbolMinMaxUnitVIN, DC Input Operating +45 VJunction Temperature Operating RangeTJ 40+150 CMAXIMUM RATINGSR atingSymbolMinMaxUnitVIN, DC VoltageVIN 42+45 VVOUT, DC VoltageVOUT +18 VStorage TemperatureTstg 55+150 CESD Capability, Human Body Model (Note 1)VESDHB4000 VESD Capability, Machine Model (Note 1)VESDMIM200 VStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice This device series incorporates ESD protection and is tested by the following methods:ESD HBM tested per AEC Q100 002 (EIA/JESD22 A 114C)ESD MM tested per AEC Q100 003 (EIA/JESD22 A 115C)THERMAL RESISTANCEP arameterSymbolConditionMinMaxUnitJunctio n to AmbientDPAKSOT 223 SOIC 8 FusedR JA 101 (Note 2)99 (Note 2)145 C/WJunction to CaseDPAKSOT 223 SOIC 8 FusedR JC C/W2.

5 1 oz., 100 mm2 copper SOLDERING TEMPERATURE AND MSLR atingSymbolMinMaxUnitLead Temperature SolderingReflow (SMD Styles Only), Lead Free (Note 3)Tsld 265 pk CMoisture Sensitivity LevelSOT223 DPAKSOIC 8 FusedMSL321 3. Lead Free, 60 sec 150 sec above 217 C, 40 sec max at CHARACTERISTICS (VIN = V, Tj = 40 C to +150 C, unless otherwise noted.)CharacteristicSymbolTest ConditionsMinTypMaxUnitOutput V mA IOUT 150 mA (Note 4) V VIN 28 V VersionVOUT0 mA IOUT 150 V VIN 28 V 40 C TJ 125 V mA IOUT 150 mA (Note 4) V VIN 28 V Version VOUT vs.

6 VINIOUT = V VIN 28 V +25mVLine V Version VOUT vs. VINIOUT = V VIN 28 V +25mVLoad Regulation VOUT vs. mA IOUT 150 mA(Note 4) +35mVDropout V VersionVIN VOUTIQ = 100 mA (Notes 4 & 5)IQ = 150 mA (Notes 4 & 5) 265315500600mVDropout V VersionVIN VOUTIQ = 100 mA (Notes 4 & 7)IQ = 150 mA (Notes 4 & 7) CurrentIqIOUT = 100 ATJ = 25 CTJ = 40 C to +85 C 21222930 AActive Ground CurrentIG(ON)IOUT = 50 mA (Note 4)IOUT = 150 mA (Note 4) Supply RejectionPSRRVRIPPLE = VP P, F = 100 Hz 67 dBOutput Capacitor for V VersionCOUTESRIOUT = mA to 150 mA(Note 4)10 F Output Capacitor for V VersionCOUTESRIOUT = mA to 150 mA(Note 4)

7 22 18 F PROTECTIONC urrent LimitIOUT(LIM)VOUT = V ( V Version) (Note 4)VOUT = V ( V Version) (Note 4)150150 500500mAShort Circuit Current LimitIOUT(SC)VOUT = 0 V (Note 4)100 500mAThermal Shutdown ThresholdTTSD(Note 6)150 200 C4. Use pulse loading to limit power Dropout voltage = (VIN VOUT), measured when the output voltage has dropped 100 mV relative to the nominal value obtained with VIN = Not tested in production. Limits are guaranteed by VDO = VIN VOUT. For output voltage set to < V, VDO will be constrained by the minimum input F, V Version22 F, V 45 VInputFigure 2.

8 Measurement CircuitFigure 3. Applications Circuit8664132 VoutCOUT10 F, V Version22 F, V VersionOutputCIN100 45 VInputRLOutputVinVin100 nFIQIINCV8664 CurvesIout = 100 mA 40 C125 C25 CFigure 4. ESR Characterization, V VersionFigure 5. Output Voltage vs. Input Voltage, V VersionLOAD CURRENT (mA)INPUT VOLTAGE (V) 6. Current Consumption vs. OutputLoad, V VersionOUTPUT CURRENT (mA) ( )OUTPUT VOLTAGE (V)QUIESCENT CURRENT (mA)180160 Maximum ESRCout = 10, 22 FStable RegionVin = 7. Current Consumption vs. OutputLoad (Low Load), V VersionOUTPUT CURRENT (mA) CURRENT (mA) 40 C125 C25 8.

9 Quiescent Current vs. Temperature, V VersionTEMPERATURE ( C)10050 CURRENT ( A)203035 Figure 9. Quiescent Current vs. Temperature, V VersionTEMPERATURE ( C)500 CURRENT (mA) = 150 mA100150 Vin = VVin = VVin = VVin = VIout = 100 CurvesRL = 50 RL = 100 TA = 25 CTA = 125 CFigure 10. Dropout Voltage vs. Output Load, V VersionFigure 11. Current Consumption vs. InputVoltage, V VersionOUTPUT LOAD (mA)INPUT VOLTAGE (V) 12. Output Current vs. Input Voltage, V VersionINPUT VOLTAGE (V)403010002040160 Dropout (V)CURRENT CONSUMPTION (mA)OUTPUT CURRENT (mA)200125 C608010050 Figure 13.

10 Output Voltage vs. Temperature, V VersionTEMPERATURE ( C)100500 VOLTAGE (V) 14. Current Limit vs. Temperature, V VersionTEMPERATURE ( C)150100 50050100400 OUTPUT CURRENT (mA)20025035025 C 40 = VVin = VLoad = 10 mANCV8664 CurvesIout = 100 mAIout = 150 mA 40 C125 C25 CFigure 15. ESR Stability, V VersionFigure 16. Output Voltage vs. Input Voltage, V VersionOUTPUT LOAD (mA)INPUT VOLTAGE (V) 17. Current Consumption vs. OutputLoad, V VersionOUTPUT LOAD (mA) ( )OUTPUT VOLTAGE (V)QUIESCENT CURRENT (mA)150125 Vin = VCout > 22 18. Current Consumption vs.


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