EMI8141 - Common Mode Filter with ESD Protection

1 Semiconductor Components Industries, LLC, 2014 June, 2014 Rev. 01 Publication Order Number: EMI8141 /DEMI8141, EMI8142,EMI8143 Common Mode Filter withESD ProtectionFunctional DescriptionThe EMI814x is a family of Common Mode Filters (CMF) withintegrated ESD Protection , a first in the industry. Differential signalingI/Os can now have both Common mode filtering and ESD Protection inone package. The EMI814x protects against ESD pulses up to 15 kVcontact per the IEC61000 4 2 EMI814x is well suited for protecting systems usinghigh speed differential ports such as USB , MIPI D PHY;corresponding ports in removable storage, and other applicationswhere ESD Protection are required in a small footprint EMI814x is available in a RoHS compliant, XDFN6 for 1 Differential Pair, XDFN 10 for 2 Differential Pair and XDFN 16package for 3 Differential Total Insertion Loss DMLOSS < dB at GHz Large Differential Mode Cutoff Frequency f3dB > 5 GHz High Common Mode Stop Band Attenuation.

2 > 10 dB at 500 MHz , 15 dB at 700 MHz Low Channel Resistance W Provides ESD Protection to IEC61000 4 2 Level 4, 15 kV Contact These Devices are Pb Free, Halogen Free/BFR Free and are RoHSCompliantApplications USB MHL mSD Card eSATA HDMI/DVI Display in Mobile Phones MIPI D PHY (CSI 2, DSI, etc) in Mobile Phones and Digital StillCamerasFigure 1. EMI8141 Electrical SchematicMARKING SCHEMATICSD evicePackageShipping ORDERING INFORMATION For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationsBrochure, BRD8011 711 AVEMI8142 MUTAGXDFN63000 / Tape & ReelEMI8142 EMI8143 XDFN16 CASE 711 AWXX = Specific Device CodeM= Date CodeG= Pb Free Package42 MG143 MGXDFN10 CASE 711AU4A MG11 EMI8143 MUTAG3000 / Tape & ReelXDFN10 XDFN163000 / Tape & ReelEMI8141, EMI8142.

3 EMI8143 FUNCTION DESCRIPTIONPin NameDevice PinTypeDescriptionEMI8141 EMI8142 EMI8143In_1+111I/OCMF Channel 1+ to Connector (External)In_1 222I/OCMF Channel 1 to Connector (External)Out_1+61016I/OCMF Channel 1+ to ASIC (Internal)Out_1 5915I/OCMF Channel 1 to ASIC (Internal)In_2+NA44I/OCMF Channel 2+ to Connector (External)In_2 NA55I/OCMF Channel 2 to Connector (External)Out_2+NA713I/OCMF Channel 2+ to ASIC (Internal)Out_2 NA612I/OCMF Channel 2 to ASIC (Internal)In_3+NANA7I/OCMF Channel 3+ to Connector (External)In_3 NANA8I/OCMF Channel 3 to Connector (External)Out_3+NANA10I/OCMF Channel 3+ to ASIC (Internal)Out_3 NANA9I/OCMF Channel 3 to ASIC (Internal)VN3,43, 83,6,14,11 GNDG roundABSOLUTE MAXIMUM RATINGS (TA = 25 C unless otherwise noted)ParameterSymbolValueUnitOperating Temperature RangeTOP 40 to +85 CStorage Temperature RangeTSTG 65 to +150 CMaximum Lead Temperature for Soldering Purposes(1/8 from Case for 10 seconds)TL260 CDC Current per LineILINE100mAStresses exceeding those listed in the Maximum Ratings table may damage the device.

4 If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be , EMI8142, EMI8143 CHARACTERISTICS (TA = 25 C unless otherwise noted)SymbolParameterTest ConditionsMinTypMaxUnitVRWMR everse Working Voltage(Note 3) VoltageIT = 1 mA; (Note 4) Leakage CurrentTA = 25 C, VIN = V, GND = 0 Resistance(Pins 1 6, 2 5) EMI8141 (Pins 1 10, 2 9, 4 7 and 5 6) EMI8142(Pins 1 16, 2 15, 4 13, 5 12, 7 10 and 8 9) Mode Insertion Loss@ Mode Cut-off Frequency50 W Source and Mode Stop Band Attenuation@ 700 MHz15dBVESDIn-system ESD Withstand Voltagea) Contact discharge per IEC 61000-4-2 standard, Level 4(External Pins)b) Contact discharge per IEC 61000-4-2 standard, Level 1(Internal Pins)(Notes 1 and 2)

5 15 2kVVCLTLP Clamping VoltageForward IPP = 8 AForward IPP = 16 AForward IPP = 8 AForward IPP = 16 parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Productperformance may not be indicated by the Electrical Characteristics if operated under different Standard IEC61000 4 2 with CDischarge = 150 pF, RDischarge = 330, GND These measurements performed with no external TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DCor continuous peak operating voltage VBR is measured at pulse test current , EMI8142, EMI8143 CHARACTERISTICS 10 9 8 7 6 5 4 3 2 + + +09dB (SDD21)FREQUENCY (Hz)Figure 2.

6 Typical Differential Mode Attenuationvs. + + +090 5 10 15 20 25 30 35 50 FREQUENCY (Hz)dB (SCC21)Figure 3. Typical Common Mode Attenuationvs. + + + +10 40 45m1 InterfaceData Rate (Gb/s)Fundamental Frequency (GHz)ESD814x Insertion Loss (dB)USB (m1)m1 = , EMI8142, EMI8143 LINE PULSE (TLP) MEASUREMENTST ransmission Line Pulse (TLP) provides current versus voltage (I V) curves in which each data point is obtained from a100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown inFigure 4. TLP I V curves of ESD Protection devices accurately demonstrate the product s ESD capability because the 10 sof amps current levels and under 100 ns time scale match those of an ESD event.

7 This is illustrated in Figure 5 where an 8 kVIEC61000 4 2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage atwhich the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I V curvesfor the EMI814x are shown in Figure SW50 W Coax Cable10 MQVCA ttenuator IM50 W Coax CableVMDUTO scilloscope Figure 4. Simplified Schematic of a Typical TLP SystemFigure 5. Comparison Between 8 kV IEC61000-4-2 and 8 A and 16 A TLP Waveforms 181614121086420021816141246810I (A)Vclamp (V)0 2 18 14 12 4 6 8 10 Vclamp (V) 18I (A) 16 14 12 10 8 6 4 20 Figure 6.

8 Positive and Negative TLP Waveforms 16 EMI8141 , EMI8142, EMI8143 7. Eye Diagram Test Setup for 5 Gbps Data RatePattern Generator(5 Gbps, PRBS31 Pattern)50 GHz Sampling OscilloscopeONsemi high speed test board(Rogers 4003 Material, SouthwestMicrowave Connectors)Figure 8. Eye Diagram 5 Gbps with and without EMI814xEye Height (mVppd)Rise Time (ps)Fall Time (ps)Jrms (ps)Jpp (ps)Reference (No Device)-Left Right XDFN10 , 711 AUISSUE BDATE 17 JUN 2014 DIM BSCNOTES:1. DIMENSIONING AND TOLERANCING PERASME , CONTROLLING DIMENSION: DIMENSIONS b APPLIES TO PLATEDTERMINAL AND IS MEASURED AND MM FROM THE TERMINAL REFbLPIN 3 ACA1(A3) 4:1 REFERENCETOP VIEWSIDE VIEWBOTTOM PITCHDIMENSIONS: MILLIMETERSMOUNTING FOOTPRINT9X1 RECOMMENDEDDETAIL = Specific Device CodeM= Date CodeG= Pb Free Package*This information is generic.

9 Please refer todevice data sheet for actual part Free indicator, G or microdot G ,may or may not be DIAGRAM*XX MGDETAIL ALALTERNATECONSTRUCTIONSL DETAIL BMOLD CMPDEXPOSED CuALTERNATECONSTRUCTIONMECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages.

10 ON Semiconductor does not convey any license under its patent rights nor therights of NUMBER:DESCRIPTION:Electronic versions are uncontrolled except when accessed directly from the Document versions are uncontrolled except when stamped CONTROLLED COPY in 1 OF 1 XDFN10 , Semiconductor Components Industries, LLC, XDFN6 , 711 AVISSUE ADATE 04 JUN 2014 DIM BSCNOTES:1. DIMENSIONING AND TOLERANCING PERASME , CONTROLLING DIMENSION: DIMENSIONS b APPLIES TO PLATEDTERMINAL AND IS MEASURED AND MM FROM TERMINAL REFbLPIN 3AA1(A3) 4:1 REFERENCETOP VIEWSIDE VIEWBOTTOM : MILLIMETERSMOUNTING FOOTPRINT5 XRECOMMENDEDDETAIL = Specific Device CodeM= Date CodeG= Pb Free Package*This information is generic.