MC1413 - High Voltage, High Current Darlington Transistor ...

1 Semiconductor Components Industries, LLC, 2006 July, 2006 Rev. 81 Publication Order Number: MC1413 /DMC1413, MC1413B,NCV1413 BHigh voltage , high CurrentDarlington Transistor ArraysThe seven NPN Darlington connected transistors in these arrays arewell suited for driving lamps, relays, or printer hammers in a variety ofindustrial and consumer applications. Their high breakdown voltageand internal suppression diodes insure freedom from problemsassociated with inductive loads. Peak inrush currents to 500 mApermit them to drive incandescent MC1413 , B with a kW series input resistor is well suited forsystems utilizing a V TTL or CMOS Pb Free Packages are Available* NCV Prefix for Automotive and Other Applications Requiring Siteand Control ChangesFigure 1. Representative Schematic kPin 91/7 MC1413 , kFigure 2. PIN CONNECTIONS91011121314151687654321(Top View)*For additional information on our Pb Free strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting Techniques ReferenceManual, 16P SUFFIXCASE 648116116 SOIC 16D SUFFIXCASE 751 BDevicePackageShipping ORDERING INFORMATIONMC1413 DSOIC 1648 Units/RailMC1413DR2 SOIC 162500 Tape & ReelSee general marking information in the device markingsection on page 5 of this data MARKING INFORMATIONMC1413 PPDIP 1625 Units/RailMC1413 BDSOIC 1648 Units/RailMC1413 BDR2 SOIC 162500 Tape & ReelMC1413 BPPDIP 1625 Units/RailNCV1413 BDR2 SOIC 162500 Tape & ReelMC1413 PGPDIP 16(Pb Free)25 Units/RailMC1413 BDR2 GSOIC 16(Pb Free)

2 2500 Tape & Reel For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationsBrochure, BRD8011 16(Pb Free)2500 Tape & ReelMC1413 DGSOIC 16(Pb Free)48 Units/TubeMC1413 BDGSOIC 16(Pb Free)48 Units/RailMC1413 BPGPDIP 16(Pb Free)25 Units/RailNCV1413 BDR2 GSOIC 16(Pb Free)2500 Tape & ReelMC1413, MC1413B, NCV1413 RATINGS (TA = 25 C, and rating apply to any one device in the package, unless otherwise noted.)RatingSymbolValueUnitOutput VoltageVO50 VInput VoltageVI30 VCollector Current ContinuousIC500mABase Current ContinuousIB25mAOperating Ambient Temperature RangeMC1413MC1413 BNCV1413 BTA 20 to +85 40 to +85 40 to +125 CStorage Temperature RangeTstg 55 to +150 CJunction TemperatureTJ150 CThermal Resistance, Junction to AmbientCase 648, P SuffixCase 751B, D SuffixRqJA67100 C/WThermal Resistance, Junction to CaseCase 648, P SuffixCase 751B, D SuffixRqJC2220 C/WElectrostatic Discharge Sensitivity (ESD)Human Body Model (HBM)Machine Model (MM)Charged Device Model (CDM)ESD20004001500 VStresses exceeding Maximum Ratings may damage the device.

3 Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice , MC1413B, NCV1413 CHARACTERISTICS (TA = 25 C, unless otherwise noted)CharacteristicSymbolMinTypMaxUnitO utput Leakage Current (VO = 50 V, TA = +85 C)(VO = 50 V, TA = +25 C)All TypesAll TypesICEX 10050mACollector Emitter Saturation voltage (IC = 350 mA, IB = 500 mA)(IC = 200 mA, IB = 350 mA)(IC = 100 mA, IB = 250 mA)All TypesAll TypesAll TypesVCE(sat) Current On Condition(VI = V) MC1413 , BII(on) voltage On Condition(VCE = V, IC = 200 mA)(VCE = V, IC = 250 mA)(VCE = V, IC = 300 mA) MC1413 , BMC1413, BMC1413, BVI(on) Current Off Condition(IC = 500 mA, TA = 85 C)All TypesII(off)50100 mADC Current Gain(VCE = V, IC = 350 mA)hFE1000 Input CapacitanceCI 1530pFTurn On Delay Time(50% EI to 50% EO)ton Off Delay Time(50% EI to 50% EO)

4 Toff Diode Leakage Current (VR = 50 V)TA = +25 CTA = +85 CIR 50100mAClamp Diode Forward voltage (IF = 350 mA)VF :NCV1413B Tlow = 40 C, Thigh = +125 C. Guaranteed by design. NCV prefix is for automotive and other applications requiringsite and change , MC1413B, NCV1413 Output Conducting at a TimePIN 10 All Types1% DUTY CYCLEVI, INPUT voltage (V)VCE(sat), SATURATION voltage (V) , COLLECTOR Current (mA)II, INPUT Current (mA)IC, COLLECTOR Current (mA)NUMBER OF DRIVERS USEDPIN 13 All Types10040030035025020015010040003002000 II, INPUT Current (mA)50IO, OUTPUT Current (mA)TYPICAL PERFORMANCE CURVES TA = 25 CVI, INPUT voltage (V) , OUTPUT Current (mA) MC1413 , BFigure 3. Output Current versus Input VoltageFigure 4. Output Current versus Input CurrentFigure 5. Typical Output CharacteristicsFigure 6. Input Characteristics MC1413 , BFigure 7. Maximum Collector Currentversus Duty Cycle(and Number of Drivers in Use)PIN 16 MaximumTypicalMC1413, MC1413B, NCV1413 DIAGRAMSPDIP 16P SUFFIXCASE 648116MC1413 PULN2003 AAWLYYWWG116MC1413 BPULQ2003 AAWLYYWWGMC1413 DGAWLYWW116MC1413 BDGAWLYWW116 SOIC 16D SUFFIXCASE 751BA= Assembly LocationWL= Wafer LotYY, Y = YearWW = Work WeekG= Pb Free PackageNCV1413 BDGAWLYWW116 PDIP 16 CASE 648 08 ISSUE VDATE 22 APR 2015 SCALE 1:1 XXXXX = Specific Device CodeA= Assembly LocationWL= Wafer LotYY= YearWW= Work WeekG= Pb Free PackageGENERICMARKING DIAGRAM*161 XXXXXXXXXXXXXXXXXXXXXXXXAWLYYWWG161*This information is generic.

5 Please refer todevice data sheet for actual part Free indicator, G or microdot G ,may or may not be 1:PIN 1. CATHODE2. CATHODE3. CATHODE4. CATHODE5. CATHODE6. CATHODE7. CATHODE8. CATHODE9. ANODE10. ANODE11. ANODE12. ANODE13. ANODE14. ANODE15. ANODE16. ANODESTYLE 2:PIN 1. COMMON DRAIN2. COMMON DRAIN3. COMMON DRAIN4. COMMON DRAIN5. COMMON DRAIN6. COMMON DRAIN7. COMMON DRAIN8. COMMON DRAIN9. GATE10. SOURCE11. GATE12. SOURCE13. GATE14. SOURCE15. GATE16. SOURCE1816 9b2 NOTE 8 DATOP VIEWM16XD1eA2 NOTE 3 MBMeBEEND VIEWEND VIEWWITH LEADS CONSTRAINEDDIMMINMAXINCHESA 10 10 MINMAXMILLIMETERSNOTES:1. DIMENSIONING AND TOLERANCING PER ASME , CONTROLLING DIMENSION: DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-AGE SEATED IN JEDEC SEATING PLANE GAUGE GS DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASHOR PROTRUSIONS.

6 MOLD FLASH OR PROTRUSIONS ARENOT TO EXCEED DIMENSION E IS MEASURED AT A POINT BELOW DATUMPLANE H WITH THE LEADS CONSTRAINED PERPENDICULARTO DATUM DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THELEADS DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THELEADS, WHERE THE LEADS EXIT THE PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARECORNERS). HNOTE 5 NOTE 6Me/2 MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages.

7 ON Semiconductor does not convey any license under its patent rights nor therights of NUMBER:DESCRIPTION:Electronic versions are uncontrolled except when accessed directly from the Document versions are uncontrolled except when stamped CONTROLLED COPY in 1 OF 1 PDIP 16 Semiconductor Components Industries, LLC, 16 CASE 751B 05 ISSUE KDATE 29 DEC 2006 SCALE 1:1 NOTES:1. DIMENSIONING AND TOLERANCING PER , CONTROLLING DIMENSION: DIMENSIONS A AND B DO NOT INCLUDE MAXIMUM MOLD PROTRUSION ( ) PER DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBAR PROTRUSIONSHALL BE ( ) TOTAL IN EXCESS OF THE DDIMENSION AT MAXIMUM MATERIAL 45_G8 PLP B A ( )BS T DKC16 ( ) 7 0 7 : MILLIMETERS1 PITCHSOLDERING FOOTPRINTSTYLE 1:PIN 2:PIN 3:PIN , DYE # , # , # , # , # , # , # , # , # , # , # , # , # , # , # , #4 STYLE 4:PIN , DYE # , # , # , # , # , # , # , # , # , # , # , # , # , # , # , #1 STYLE 5:PIN , DYE # , # , # , # , # , # , # , # , # , # , # , # , # , # , # , #1 STYLE 6:PIN 7.

8 PIN N DRAIN (OUTPUT) DRAIN (OUTPUT) P DRAIN (OUTPUT) DRAIN (OUTPUT) DRAIN (OUTPUT) P P DRAIN (OUTPUT) DRAIN (OUTPUT) DRAIN (OUTPUT) N DRAIN (OUTPUT) DRAIN (OUTPUT) N CH16898 XMECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of NUMBER:DESCRIPTION:Electronic versions are uncontrolled except when accessed directly from the Document versions are uncontrolled except when stamped CONTROLLED COPY in 1 OF 1 SOIC 16 Semiconductor Components Industries, LLC, , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliatesand/or subsidiaries in the United States and/or other countries.

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