Transcription of MC1413, MC1413B, High Voltage, High Current Darlington ...
1 MC1413, MC1413B, NCV1413B. high voltage , high Current Darlington transistor Arrays The seven NPN Darlington connected transistors in these arrays are well suited for driving lamps, relays, or printer hammers in a variety of industrial and consumer applications. Their high breakdown voltage and internal suppression diodes insure freedom from problems associated with inductive loads. Peak inrush currents to 500 mA PDIP 16. P SUFFIX. permit them to drive incandescent lamps. CASE 648. The MC1413, B with a kW series input resistor is well suited for 16. systems utilizing a V TTL or CMOS Logic. 1. Features SOIC 16. Pb Free Packages are Available* 16.
2 D SUFFIX. CASE 751B. NCV Prefix for Automotive and Other Applications Requiring Site 1. and Control Changes 1/7 MC1413, B ORDERING INFORMATION. k Pin 9 Device Package Shipping . MC1413D SOIC 16 48 Units/Rail k MC1413DG SOIC 16 48 Units/Tube k (Pb Free). MC1413DR2 SOIC 16 2500 Tape & Reel MC1413DR2G SOIC 16 2500 Tape & Reel (Pb Free). Figure 1. Representative Schematic Diagram MC1413P PDIP 16 25 Units/Rail MC1413PG PDIP 16 25 Units/Rail (Pb Free). 1 16 MC1413BD SOIC 16 48 Units/Rail MC1413 BDG SOIC 16 48 Units/Rail 2 15 (Pb Free). MC1413 BDR2 SOIC 16 2500 Tape & Reel 3 14 MC1413 BDR2G SOIC 16 2500 Tape & Reel (Pb Free). 4 13 MC1413BP PDIP 16 25 Units/Rail MC1413 BPG PDIP 16 25 Units/Rail 5 12 (Pb Free).
3 NCV1413 BDR2 SOIC 16 2500 Tape & Reel 6 11. NCV1413 BDR2G SOIC 16 2500 Tape & Reel (Pb Free). 7 10. For information on tape and reel specifications, including part orientation and tape sizes, please 8 9 refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (Top View). DEVICE MARKING INFORMATION. Figure 2. PIN CONNECTIONS See general marking information in the device marking section on page 5 of this data sheet. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2006 1 Publication Order Number: July, 2006 Rev.
4 8 MC1413/D. MC1413, MC1413B, NCV1413B. MAXIMUM RATINGS (TA = 25 C, and rating apply to any one device in the package, unless otherwise noted.). Rating Symbol Value Unit Output voltage VO 50 V. Input voltage VI 30 V. Collector Current Continuous IC 500 mA. Base Current Continuous IB 25 mA. Operating Ambient Temperature Range TA C. MC1413 20 to +85. MC1413B 40 to +85. NCV1413B 40 to +125. Storage Temperature Range Tstg 55 to +150 C. Junction Temperature TJ 150 C. Thermal Resistance, Junction to Ambient RqJA C/W. Case 648, P Suffix 67. Case 751B, D Suffix 100. Thermal Resistance, Junction to Case RqJC C/W. Case 648, P Suffix 22. Case 751B, D Suffix 20.
5 Electrostatic Discharge Sensitivity (ESD) ESD V. Human Body Model (HBM) 2000. Machine Model (MM) 400. Charged Device Model (CDM) 1500. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. MC1413, MC1413B, NCV1413B. ELECTRICAL CHARACTERISTICS (TA = 25 C, unless otherwise noted). Characteristic Symbol Min Typ Max Unit Output Leakage Current ICEX mA. (VO = 50 V, TA = +85 C) All Types 100. (VO = 50 V, TA = +25 C) All Types 50.
6 Collector Emitter Saturation voltage VCE(sat) V. (IC = 350 mA, IB = 500 mA) All Types (IC = 200 mA, IB = 350 mA) All Types (IC = 100 mA, IB = 250 mA) All Types Input Current On Condition II(on) mA. (VI = V) MC1413, B Input voltage On Condition VI(on) V. (VCE = V, IC = 200 mA) MC1413, B (VCE = V, IC = 250 mA) MC1413, B (VCE = V, IC = 300 mA) MC1413, B Input Current Off Condition All Types II(off) 50 100 mA. (IC = 500 mA, TA = 85 C). DC Current Gain hFE 1000 . (VCE = V, IC = 350 mA). Input Capacitance CI 15 30 pF. Turn On Delay Time ton ms (50% EI to 50% EO). Turn Off Delay Time toff ms (50% EI to 50% EO). Clamp Diode Leakage Current TA = +25 C IR 50 mA.
7 (VR = 50 V) TA = +85 C 100. Clamp Diode Forward voltage VF V. (IF = 350 mA). NOTE: NCV1413B Tlow = 40 C, Thigh = +125 C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. 3. MC1413, MC1413B, NCV1413B. TYPICAL PERFORMANCE CURVES TA = 25 C. 400 400. I O , OUTPUT Current (mA). I O , OUTPUT Current (mA). 300 300 All Types MC1413, B. 200 200. 100 100. 0 0. 0 10 11 12 0 50 100 150 200 250 300 350 400. VI, INPUT voltage (V) II, INPUT Current (mA). Figure 3. Output Current versus Input voltage Figure 4. Output Current versus Input Current 800 700 PIN 13. IC , COLLECTOR Current (mA).
8 I I, INPUT Current (mA). 600 PIN 10 Maximum 500 1 Output Conducting at a Time PIN 16 Typical 400. 300 200. All Types 100. 0 0. 0 0 VCE(sat), SATURATION voltage (V) VI, INPUT voltage (V). Figure 5. Typical Output Characteristics Figure 6. Input Characteristics MC1413, B. 1000. 1. I C, COLLECTOR Current (mA). 700. NUMBER OF DRIVERS USED. 500 2. 3. 300. 4. 200 5. 6. 7. 100. 10 20 30 50 70 100. % DUTY CYCLE. Figure 7. Maximum Collector Current versus Duty Cycle (and Number of Drivers in Use). 4. MC1413, MC1413B, NCV1413B. MARKING DIAGRAMS. PDIP 16. P SUFFIX. CASE 648. 16 16. MC1413P MC1413BP. ULN2003A ULQ2003A. AWLYYWWG AWLYYWWG. 1 1.
9 SOIC 16. D SUFFIX. CASE 751B. 16 16 16. MC1413DG MC1413 BDG NCV1413 BDG. AWLYWW AWLYWW AWLYWW. 1 1 1. A = Assembly Location WL = Wafer Lot YY, Y = Year WW = Work Week G = Pb Free Package 5. MC1413, MC1413B, NCV1413B. PACKAGE DIMENSIONS. PDIP 16. P SUFFIX. CASE 648 08. ISSUE T. NOTES: A 1. DIMENSIONING AND TOLERANCING PER. ANSI , 1982. 2. CONTROLLING DIMENSION: INCH. 16 9 3. DIMENSION L TO CENTER OF LEADS. WHEN FORMED PARALLEL. B 4. DIMENSION B DOES NOT INCLUDE. 1 8 MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. F INCHES MILLIMETERS. C L DIM MIN MAX MIN MAX. A S B C SEATING D T PLANE F G BSC BSC. H K M H BSC BSC. J. G J D 16 PL K L ( ) M T A M M 0_ 10 _ 0_ 10 _.
10 S 6. MC1413, MC1413B, NCV1413B. PACKAGE DIMENSIONS. SOIC 16. D SUFFIX. CASE 751B 05. ISSUE J. A . NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI. , 1982. 16 9 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE. B MOLD PROTRUSION. P 8 PL. 4. MAXIMUM MOLD PROTRUSION ( ). 1 8. ( ) M B S PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR. PROTRUSION. ALLOWABLE DAMBAR. PROTRUSION SHALL BE ( ) TOTAL. IN EXCESS OF THE D DIMENSION AT. MAXIMUM MATERIAL CONDITION. G. MILLIMETERS INCHES. DIM MIN MAX MIN MAX. F A K R X 45 _ B C D C F T SEATING G BSC BSC. PLANE J J M. K D 16 PL M 0_ 7_ 0_ 7_. P ( ) M T B S A S R 7. MC1413, MC1413B, NCV1413B.